XC7K160T-2FFG676I Allicdata Electronics
Allicdata Part #:

122-1962-ND

Manufacturer Part#:

XC7K160T-2FFG676I

Price: $ 68.95
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 400 I/O 676FCBGA
More Detail: N/A
DataSheet: XC7K160T-2FFG676I datasheetXC7K160T-2FFG676I Datasheet/PDF
Quantity: 200
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 4 (72 Hours)
1 +: $ 68.95000
Stock 200Can Ship Immediately
$ 68.95
Specifications
Series: Kintex®-7
Part Status: Active
Lead Free Status / RoHS Status: --
Number of LABs/CLBs: 12675
Moisture Sensitivity Level (MSL): --
Number of Logic Elements/Cells: 162240
Total RAM Bits: 11980800
Number of I/O: 400
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Number of Gates: --
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Base Part Number: XC7K160
Description

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A Field Programmable Gate Array (FPGA) is a semiconductor device that we use to design electronic systems, suitably programmed and configured to request specific functions or operations. They include logic blocks, embedded processor cores, and analog modules and are typically used in communications, medical, military and aerospace applications.

The Xilinx XC7K160T-2FFG676I is a FPGA from the Spartan-7 family. This particular FPGA has a practical real-world performance of 17.30Gbps per device and features sixteen 4KB RAMs, eight 4K Look-Up Tables (LUTs), and ten Multi-purpose Interfaces blocks. It is suitable for use in a variety of embedded projects where space and power savings are required.

The XC7K160T-2FFG676I is made using the 28nm Low Power Plus process technology, which is usually either TSMC, Samsung or UMC proprietary 28 nm foundries. The device also boasts advanced low-power, high-performance features that are designed to deliver advanced features such as 1.1 to 1.4V and a wide variety of I/Os for 1.2, 1.35, and 1.8V of operation. This makes the device suitable for low-power mobile applications.

When it comes to the power efficiency of the device, the XC7K160T-2FFG676I claims to deliver a typical power dissipation of 6.5W/mm² while providing an impressive performance of 17.30 Gbps/device under typical conditions.

The onboard I/O sources of the FPGA consist of SERDES, PLLs, transceivers and HF testing. There are also an extensive selection of peripherals, which includes 4K EISGA3 and 4K EIMAX3 RAM, three UARTs, two I2Cs, USB and Ethernet, and SPI double bus masters. This makes it the ideal device for applications that require high-speed data transmission and data reception.

The device also features an integrated FPGA-in-cell (FIC) processor core, which uses an MIPS architecture for increased flexibility, performance and scalability. The core has an operating frequency of up to 256MHz and provides 8K Instruction word capacity with 8K Data word capacity. This allows the device to support complex algorithm-based processing and hardware acceleration. Additionally, up to 96 DSP slices are available on board the device.

The Xilinx XC7K160T-2FFG676I also incorporates numerous distributed RAM blocks, which allow for the storage of variables. These RAM blocks amount to 16.75 MB and can be expanded to 32 MB with additional distributed RAM. This makes the device incredibly efficient in terms of data storage and enables it to perform more complex operations.

The XC7K160T-2FFG676I can interface with both external and internal devices, thanks to its large selection of I/O configurations. The device supports up to 803 configurable I/O elements, which include OAM asynchronous FIFO, SGMII and serial PLL. This enables the device to provide more reliable communication with other components, while still offering high speed data transfer capabilities.

The XC7K160T-2FFG676I is an ideal choice for a wide range of applications, such as those related to communications, automotive, industrial, medical, and military. Thanks to its robust features and capabilities, it can deliver high-speed processing, low-power performance, and reliable communications for intelligently designed embedded applications.

The specific data is subject to PDF, and the above content is for reference

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