XCVU080-3FFVB1760E Allicdata Electronics
Allicdata Part #:

XCVU080-3FFVB1760E-ND

Manufacturer Part#:

XCVU080-3FFVB1760E

Price: $ 10.40
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 702 I/O 1760FCBGA
More Detail: N/A
DataSheet: XCVU080-3FFVB1760E datasheetXCVU080-3FFVB1760E Datasheet/PDF
Quantity: 1000
1 +: $ 9.45000
Stock 1000Can Ship Immediately
$ 10.4
Specifications
Series: Virtex® UltraScale™
Part Status: Active
Number of LABs/CLBs: 55714
Number of Logic Elements/Cells: 975000
Total RAM Bits: 51200000
Number of I/O: 702
Voltage - Supply: 0.970 V ~ 1.030 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Description

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The XCVU080-3FFVB1760E is an FPGA (Field Programmable Gate Array) integrated circuit developed by Xilinx, Inc. It is an embedded device, used to reconfigure the functionality of a system on a chip (SoC). This device provides a flexible and cost-effective way to design and implement complex applications that require reconfigurable logic. It also offers high performance, high reliability, and low power consumption.

FPGAs are used in many different applications, ranging from telecommunications, industrial automation, military, and aerospace. This flexibility is one of the key advantages of FPGAs over Application-Specific Integrated Circuits (ASICs). An FPGA can be programmed to adapt and change according to the application’s requirements, while an ASIC is designed to perform a single function. This makes FPGAs more suitable for applications that need frequent updates.

The XCVU080-3FFVB1760E is designed to perform a wide range of tasks, such as signal processing, data acquisition, image and video processing, mathematics and graphics applications. As the main advantages, it offers high levels of reliability, high performance, and low power consumption. The reconfigurable nature of the FPGA also allows it to be used for application-specific protocol implementation.

FPGAs are composed of a two-dimensional array of logic elements, each of which can be programmed to perform different logic functions. The logic element can be programmed to perform functions such as adding, subtracting, comparing, and Boolean operations. This allows for the FPGA to be reprogrammed to suit the application being developed.

The XCVU080-3FFVB1760E is designed to provide high levels of speed, reliability, and power efficiency. It features 6,144 logic gates, 20 configurable Multi-Gigabit Transceivers (MGTs), 1,504, 24-bit Distributed RAM (DRAM), and 1,344 Digital Signal Processing (DSP) slices. The FPGA also has an integrated power management system that reduces power consumption significantly.

The FPGA also features 16MB external RAM, which is used to store large amount of data. Moreover, the device offers error correction and secure communication with the host system. Additionally, the FPGA supports the secure and efficient transfer of data from the external RAM to the internal memories of the FPGA.

In short, the XCVU080-3FFVB1760E is an embedded device for reconfigurable logic applications. It offers a high level of performance, reliability, and power efficiency.Its 6,144 logic gates, 20 configurable Multi-Gigabit Transceivers (MGTs), 1,504, 24-bit Distributed RAM (DRAM) and1,344 Digital Signal Processing (DSP) slices make the FPGA suitable for a wide range of applications. With the integrated power management system, the FPGA reduces power consumption, making it an ideal choice for embedded applications. Moreover, the FPGA also supports error correction, secure communication, and efficient data transfer. Therefore, the XCVU080-3FFVB1760E is a powerful and reliable FPGA solution for embedded applications.

The specific data is subject to PDF, and the above content is for reference

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