XCVU3P-2FFVC1517E Allicdata Electronics
Allicdata Part #:

XCVU3P-2FFVC1517E-ND

Manufacturer Part#:

XCVU3P-2FFVC1517E

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 520 I/O 1517FCBGA
More Detail: N/A
DataSheet: XCVU3P-2FFVC1517E datasheetXCVU3P-2FFVC1517E Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: Virtex® UltraScale+™
Part Status: Active
Number of LABs/CLBs: 49260
Number of Logic Elements/Cells: 862050
Total RAM Bits: 130355200
Number of I/O: 520
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)
Description

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Field programmable gate array (FPGA) integrated circuits are becoming popular in the embedded industry. They offer a powerful, versatile and cost-effective solution for embedded applications that require programmable logic and specific connectivity. A product line of FPGAs that provides high-end performance and flexibility is the Xilinx family of FPGAs, which includes the XCVU3P-2FFVC1517E.

The XCVU3P-2FFVC1517E is a silicon device with 1152 digital signal processing (DSP) slices and 18,434 logic cells. It offers 14 transceivers and support for 16-bit and 32-bit floating point. It is also provided with 1.12Mb of integrated memory and 8Mb of internal on-chip RAM. Additionally, it has 72 s-ports, 192Kb of embedded SRAM and other features, making it an highly versatile FPGA.

The XCVU3P-2FFVC1517E is ideally suited for embedded applications requiring the parallel processing of large datasets, the interaction between firmware, software and hardware, and the handling of real-time data. It is commonly used in medical, industrial, computing and communications field to control large motors or for receiving, processing and transmitting large amount of data.

The XCVU3P-2FFVC1517E implements what is known as an “infrastructure FPGA” – a programmable integrated circuit optimized for the design of systems that must meet size, weight and power requirements. This FPGA is designed to be used as one of the cores in a larger system design. For example, an embedded system could incorporate an XCVU3P-2FFVC1517E as its “brain” and consist of multiple FPGA cores. Each core could then manage a separate portion of the system.

The XCVU3P-2FFVC1517E is programmed using a Verilog-like language called SystemVerilog. SystemVerilog is a hardware design language (HDL) that allows developers to define the logic elements, connections and clock signals associated with the FPGA’s inputs and outputs. The SystemVerilog programming language is used to create Universal Verification Methodology (UVM) compliant test benches that verify the correct functioning of the FPGA.

When used in conjunction with the Xilinx Vivado Design Suite, the XCVU3P-2FFVC1517E makes it possible to create systems with a high-performance FPGA, fast speed of response and low latency. With its 1152 DSP slices and 18,434 logic cells, the XCVU3P-2FFVC1517E provides developers with the necessary resources to design embedded systems with fast processing time and minimal power consumption.

In conclusion, the XCVU3P-2FFVC1517E is an excellent candidate for embedded system design due to its unbeatable combination of features and price. It is highly flexible and provides a powerful FPGA solution for a wide range of embedded applications. With its fast processing speed and low power consumption, the XCVU3P-2FFVC1517E is ideally suited for the most demanding embedded system designs.

The specific data is subject to PDF, and the above content is for reference

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