XLI98-10-2.25-P Allicdata Electronics
Allicdata Part #:

1168-1968-ND

Manufacturer Part#:

XLI98-10-2.25-P

Price: $ 0.29
Product Category:

Fans, Thermal Management

Manufacturer: t-Global Technology
Short Description: XL25 CERAMIC 10X10MM W/LI98C ADH
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Cerami...
DataSheet: XLI98-10-2.25-P datasheetXLI98-10-2.25-P Datasheet/PDF
Quantity: 1761
1 +: $ 0.25830
10 +: $ 0.24885
25 +: $ 0.23663
50 +: $ 0.23033
100 +: $ 0.22718
250 +: $ 0.21163
500 +: $ 0.19918
1000 +: $ 0.18051
5000 +: $ 0.17428
Stock 1761Can Ship Immediately
$ 0.29
Specifications
Series: XL-25
Part Status: Active
Type: Heat Spreader
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square
Length: 0.394" (10.00mm)
Width: 0.394" (10.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.089" (2.25mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Ceramic
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are an important part of any industrial electronic system. They help to reduce heat build-up within devices as well as help to dissipate large amounts of heat from large-scale systems. The XLI98-10-2.25-P heat sink is an electronic-grade type of heat sink, specifically designed to provide an efficient cooling solution in all types of industrial electronics.

The XLI98-10-2.25-P is a high-performance heat sink which incorporates features such as its special profiled fin which is used to increase its overall surface area. The fins are formed so as to form a convex shape with an open pore matrix. By increasing the heat dissipation surface area, heat is removed from the area more quickly and effectively.

The XLI98-10-2.25-P heat sink is also designed to be compatible with industry standard cooling fans. It is designed to fit the standard 2.25 inch fan opening, allowing users to easily install and use the device. The fan opening also has a serrated airflow pattern for maximum cooling efficiency.

The heat sink is made from an aluminum alloy and has an anodized finish. This provides increased corrosion resistance and is rugged enough to withstand high temperatures. The aluminum alloy is also lightweight and has a low thermal conductivity, which ensures better heat transfer and reduces the weight of the heat sink.

The XLI98-10-2.25-P thermal-heat sink has a remarkably high heat-dissipation capacity which makes it suitable for industrial applications. Its thermal performance is enhanced by its convex-shaped fins which provide a higher surface area for greater heat dissipation. The heat sink also has an integrated cooling fan which helps to ensure uniform cooling across the entire surface. This cooling fan also illustrates the flexibility and compatibility of the heat sink, allowing users to customize their cooling systems.

The XLI98-10-2.25-P thermal-heat sink is ideal for applications where large amounts of heat must be removed. It can be used in a variety of other industries such as medical electronics, automotive electronics, consumer electronics, and power electronics. It is also suitable for area-specific cooling applications such as in cellular towers, military applications, and data centers.

In conclusion, the XLI98-10-2.25-P thermal-heat sink offers an efficient and reliable cooling solution for industrial electronics. It is constructed from a highly durable aluminum alloy and has a serrated airflow pattern for maximum cooling efficiency. The device also has a high-performance fan which further enhances its performance. Lastly, its flexibility allows it to be used in a variety of industries and areas, making it an optimal choice for industrial cooling.

The specific data is subject to PDF, and the above content is for reference

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