XLI98C-10-2.15-P

The XLI98C-10-2.15-P ​thermal - heat sink is an essential component that helps manage the heat generated by components, such as processors, GPUs, and other high-end electronic components. It does this by conducting the generated heat away from the component so that it can be dissipated out of the system or dispersed in the environment. The XLI98C-10-2.15-P thermal - heat sink is designed specifically to reduce the thermal resistance of the component it’s attached to, and to also reduce the overall temperature of the system. It achieves this by transferring the heat generated by the components as fast as possible into its frame, allowing for a more efficient dissipation of the heat.

The XLI98C-10-2.15-P thermal - heat sink is designed to be used in a number of applications, ranging from low power processors, GPUs, and other high-end components, to larger power orientated components such as power semiconductors, and even in some industrial and commercial applications. The XLI98C-10-2.15-P thermal - heat sink utilizes a variety of features including its lightweight, non-corrosive construction, its quick assembly capabilities, its heatsink fins, its high thermal dissipation rating, and its aluminum heat sinks.

The XLI98C-10-2.15-P thermal - heat sink features an aluminum frame, which is designed to be easy to assemble and can be adjusted to accommodate different types of components. The aluminum is highly conductive, which ensures that the heat generated by the components is quickly transferred into the frame. The frame of the XLI98C-10-2.15-P thermal - heat sink is also designed to provide an increased surface area, which allows for a greater amount of heat to be transferred away from the components. The frame also includes a number of seats, which allow for the installation of additional heatsinks, and may also be used to attach fans or other cooling systems to improve the system’s thermal performance.

The XLI98C-10-2.15-P thermal - heat sink utilizes a combination of heatsink fins, thermal paste, and thermal pads to ensure efficient cooling of the components. The aluminum frame is designed to disperse heat quickly and evenly, while the thermal paste and thermal pads are designed to reduce the thermal resistance of the component. The heatsink fins are designed to further increase the thermal performance of the system by increasing the surface area for air or other cooling medium to flow through.

The XLI98C-10-2.15-P thermal - heat sink can be used in a variety of applications, such as low-power processors, 3D graphic cards, embedded systems, automotive electronics, and industrial systems. It is capable of providing superior heat dissipation performance and it can be used in applications where heat management is critical. The XLI98C-10-2.15-P thermal - heat sink can be adjusted in order to accommodate different sizes of components and to provide better cooling performance for components with high thermal resistances. It can also be used to add additional heatsinks and to improve system airflow, allowing for an improved thermal performance.

The XLI98C-10-2.15-P thermal - heat sink is a very reliable and effective product for managing the heat generated by high-end electronic components. It is designed to reduce the thermal resistance of the component, which allows for a more efficient dissipation of heat and also helps improve the overall system temperature. The XLI98C-10-2.15-P thermal - heat sink is also designed to increase the surface area for better airflow and it can be easily adjusted in order to provide a better heat dissipation performance for different components.