XLI98C-30-2.15-P

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Thermal - Heat Sinks are an integral part of thermal management solutions. XLI98C-30-2.15-P is a heat sink of this kind that comes with its own set of application fields and principles of operation. It is hence important to know more about the same before considering its use as part of a custom thermal management solution.

Construction and Configuration of the XLI98C-30-2.15-P

As per the details available, the XLI98C-30-2.15-P is a heat sink manufactured from aluminium that weighs 98.8 kilograms. It is configured with 30 fins that measure 2.15 mm in height. The approximate thermal resistance of this heat sink is 0.80 K/W and this resistance enables it to be effectively used for dissipating heat generated by higher power level components. Additionally, its fins have an effectual surface area of 320 cm² as per the profiles and spacings used in the heat sink’s construction. A special locking clip is also available, which forms part of the kit and helps to ensure effective heat transfer.

Application Fields of the XLI98C-30-2.15-P

TheXLI98C-30-2.15-P is best suited for high wattage and highly efficient loads. As such, they are generally used in environments that require the dissipation of heat generated by processors, high-power memory chips, LED arrays and assemblies. This heat sink design is optimised to perform faster and more efficient heat dissipation, which plays a key role in the operation of such components.

The design of the heat sink also makes it suitable for use in confined spaces such as laptop, small form factor and system on chip designs that require components with cooling solutions. The XLI98C-30-2.15-P is also suitable for use in the majority of consumer electronics products such as audio/video equipments, personal computers etc.

Working Principle of the XLI98C-30-2.15-P

The working principle of this thermal management solution is a combination of both natural and forced convection of air. Natural air convection offers the best transfer of heat in larger spaces. This involves the replacement of the hot air surrounding the heat sink by the cooler room air, which helps to reduce the temperature of the heat sink. However, when working in confined spaces, this movement is not possible due to the lack of space. The XLI98C-30-2.15-P is then fitted with heat sinks provided with four small fans, ensuring forced air-convection. This helps to keep the temperature of the elements at the optimum level for operation.

In addition, to ensure a fast heat transfer between the components and the heat sink, the fan is designed to read the heat levels around the components and adjust accordingly. This helps to ensure that the accurate airflow and temperatures are maintained, thus increasing the life of the components.

Conclusion

The XLI98C-30-2.15-P is a heat sink designed to perform in confined areas and provide reliable thermal management of the components under it. With its 0.80 K/W thermal resistance and 320 cm of effective surface area, the heat sink can effectively dissipate the heat generated by high wattage and high-end component assemblies and devices.

Its application fields are suitable for most of the consumer electronic products, such as audio/video equipments and personal computers, as well as cooling solutions for small form factor and system on chip designs. Furthermore, its fan-assisted forced air-convection operation ensures an efficient heat transfer to ensure the long-term health of the electronic components within it.

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