Car dual-channel audio amplifier - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
XCZU17EG-L1FFVC 1760I-ND	XCZU17EG-L1FFVC 1760I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 926K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5) Number of I/O: 512	1000 Order	1+: $3.78
XCZU17EG-2FFVB1 517I-ND	XCZU17EG-2FFVB1 517I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 926K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 644	1000 Order	--
XCZU2EG-2SFVC78 4I-ND	XCZU2EG-2SFVC78 4I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	--
XCZU17EG-1FFVB1 517I-ND	XCZU17EG-1FFVB1 517I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 926K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 644	1000 Order	--
XCZU11EG-L2FFVC 1156E-ND	XCZU11EG-L2FFVC 1156E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 653K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 360	1000 Order	1+: $3.15
XCZU7EG-3FFVC11 56E-ND	XCZU7EG-3FFVC11 56E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 667MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 360	1000 Order	1+: $2.52
XCZU3EG-1SBVA48 4E-ND	XCZU3EG-1SBVA48 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 154K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19) Number of I/O: 82	1000 Order	1+: $254.709
XCZU5EV-L2SFVC7 84E-ND	XCZU5EV-L2SFVC7 84E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	1+: $1.26
XCZU7EG-2FBVB90 0E-ND	XCZU7EG-2FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU11EG-L1FFVB 1517I-ND	XCZU11EG-L1FFVB 1517I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 653K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 488	1000 Order	1+: $2.52
XCZU4EG-3SFVC78 4E-ND	XCZU4EG-3SFVC78 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	1+: $0.63
XCZU6EG-1FFVC90 0E-ND	XCZU6EG-1FFVC90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 469K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $0.63
XCZU19EG-1FFVC1 760E-ND	XCZU19EG-1FFVC1 760E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 1143K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5) Number of I/O: 512	1000 Order	--
XCZU19EG-L2FFVD 1760E-ND	XCZU19EG-L2FFVD 1760E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 1143K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5) Number of I/O: 308	1000 Order	1+: $5.04
XCZU2EG-2SBVA48 4E-ND	XCZU2EG-2SBVA48 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19) Number of I/O: 82	1000 Order	1+: $228.501
XCZU19EG-2FFVB1 517I-ND	XCZU19EG-2FFVB1 517I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 1143K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 644	1000 Order	1+: $3.78
XCZU2EG-1SFVA62 5I-ND	XCZU2EG-1SFVA62 5I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21) Number of I/O: 180	1000 Order	1+: $213.759
XCZU7EG-2FFVC11 56I-ND	XCZU7EG-2FFVC11 56I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 360	1000 Order	1+: $1.89
XCZU15EG-1FFVC9 00I-ND	XCZU15EG-1FFVC9 00I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 747K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $2.52
XCZU2EG-2SBVA48 4I-ND	XCZU2EG-2SBVA48 4I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19) Number of I/O: 82	1000 Order	1+: $261.261
XCZU6EG-2FFVB11 56I-ND	XCZU6EG-2FFVB11 56I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 469K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 328	1000 Order	--
XCZU11EG-1FFVF1 517I-ND	XCZU11EG-1FFVF1 517I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 653K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 464	1000 Order	--
XCZU19EG-L1FFVE 1924I-ND	XCZU19EG-L1FFVE 1924I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 1143K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1924-FCBGA (45x45) Number of I/O: 668	1000 Order	1+: $3.78
XCZU17EG-3FFVB1 517E-ND	XCZU17EG-3FFVB1 517E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 667MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 926K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 644	1000 Order	1+: $4.41
XCZU5EG-L1SFVC7 84I-ND	XCZU5EG-L1SFVC7 84I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	1+: $0.63
XCZU4EG-3FBVB90 0E-ND	XCZU4EG-3FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU5EG-3SFVC78 4E-ND	XCZU5EG-3SFVC78 4E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	1+: $1.26
XCZU15EG-2FFVC9 00E-ND	XCZU15EG-2FFVC9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 747K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $2.52
XCZU2EG-3SFVA62 5E-ND	XCZU2EG-3SFVA62 5E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 667MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21) Number of I/O: 180	1000 Order	1+: $334.152
XCZU3EG-1SFVC78 4I-ND	XCZU3EG-1SFVC78 4I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 154K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	--
XCZU3EG-2SFVC78 4I-ND	XCZU3EG-2SFVC78 4I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 154K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	--
XCZU9EG-1FFVB11 56I-ND	XCZU9EG-1FFVB11 56I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 599K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 328	1000 Order	--
XCZU3EG-2SBVA48 4I-ND	XCZU3EG-2SBVA48 4I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 154K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19) Number of I/O: 82	1000 Order	1+: $407.043
XCZU7EV-1FFVF15 17E-ND	XCZU7EV-1FFVF15 17E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 464	1000 Order	1+: $1.26
XCZU9EG-L1FFVB1 156I-ND	XCZU9EG-L1FFVB1 156I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 599K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 328	1000 Order	1+: $1.89
XCZU11EG-1FFVB1 517E-ND	XCZU11EG-1FFVB1 517E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 653K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 488	1000 Order	1+: $1.26
XCZU7EG-L2FBVB9 00E-ND	XCZU7EG-L2FBVB9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU19EG-1FFVB1 517E-ND	XCZU19EG-1FFVB1 517E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 1143K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 644	1000 Order	--
XCZU7EV-2FFVF15 17E-ND	XCZU7EV-2FFVF15 17E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 464	1000 Order	1+: $1.89
XCZU19EG-3FFVD1 760E-ND	XCZU19EG-3FFVD1 760E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 667MHz, 1.5GHz Primary Attributes: ZynqUltraScale+ FPGA, 1143K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5) Number of I/O: 308	1000 Order	1+: $6.3

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