XCZU17EG-3FFVC1760E Allicdata Electronics
Allicdata Part #:

XCZU17EG-3FFVC1760E-ND

Manufacturer Part#:

XCZU17EG-3FFVC1760E

Price: $ 5.54
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 512 I/O 1760FCBGA
More Detail: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua...
DataSheet: XCZU17EG-3FFVC1760E datasheetXCZU17EG-3FFVC1760E Datasheet/PDF
Quantity: 1000
1 +: $ 5.04000
Stock 1000Can Ship Immediately
$ 5.54
Specifications
Series: Zynq® UltraScale+™ MPSoC EG
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 667MHz, 1.5GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of I/O: 512
Description

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The XCZU17EG-3FFVC1760E is an embedded system-on-chip (SoC) that offers a wide range of applications and a high-performance FPGA to deliver the best performance. It is designed to meet the needs of demanding embedded applications such as consumer, automotive, and industrial control. The XCZU17EG-3FFVC1760E is based on the Versal™ ACAP architecture and is manufactured on TSMC\'s 16nm FinFET process. It features four Zynq® ultrascale+ MPSoC processing systems, sixteen teams of hardened HBM2 memory controllers, plus sixteen teams of hardened DMA/ DSP/ I/O logic for data-intensive operations.

The XCZU17EG-3FFVC1760E is built upon the Versal ACAP architecture to meet the demands of the most challenging embedded design requirements. Its integrated FPGA core provides the best performance at a high gate count without requiring additional components. This enables the integration of heterogeneous compute elements in a single device while providing high-speed connection, memory hierarchy, and I/O flexibility.

The XCZU17EG-3FFVC1760E also enables an extensive range of applications, including: vision, machine learning and artificial intelligence applications, communication and data processing, motor control and drive systems, audio enhancement, automotive applications, and much more. The device allows designers to quickly and easily develop optimized solutions that fully integrate hardware and software, resulting in reduced design time up to 40 percent when compared to using a discrete FPGA and processor solution.

The XCZU17EG-3FFVC1760E is ideal for a broad range of applications requiring high-speed, high-performance, and low latency operation. Its 16nm FinFET process delivers up to 22.8Gbps of PCI Express® Gen4 communication interface and up to 21.9Gbps transceivers. It also features up to 12.8 million logic cells, 12.6TB/s of HBM2 memory bandwidth, up to 24 DMA/ I/O and 18 DSP engines, and an extensive range of selectable logic and I/O modules. This device supports various peripherals and commands, so that the user can select and implement different configurations based on the user\'s particular application requirements.

The XCZU17EG-3FFVC1760E’s Working principle is based on a multiprocessor architecture. It is designed to leverage both software-defined and hardware-defined models of operation, as well as distributed system architectures to best meet the needs of a variety of embedded applications. The device harnesses the best FPGA and MPSoC technology, with built-in accelerated libraries, which makes the toughest tasks in embedded design easier. Additionally, the device offers advanced features such as dynamic reconfiguration and memory compression, which reduce system design complexity, and minimize power and costs.

The XCZU17EG-3FFVC1760E’s Working principles are strongly supported by Vivado Design Suite, which enables easy setup of the SoC, easy configuration of accelerators for custom algorithms, and more. The Versal ACAP integrated development environment (IDE) also provides a comprehensive set of tools, libraries, and RTL cores that optimize SoC applications to the hardware platform, while ensuring hardware and software compatibility. With these tools, embedded designers can easily create and develop optimized solutions quickly, while minimizing the system power and design costs.

The XCZU17EG-3FFVC1760E is the perfect choice for embedded designers that need to accelerate their designs with high-speed and high-performance. Its wide range of applications and its FPGA core provide the best performance at a high gate count. Additionally, the advanced features make it an ideal choice for embedded systems that require low latency operation and a comprehensive set of features and peripherals.

The specific data is subject to PDF, and the above content is for reference

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