
Allicdata Part #: | XCZU7EV-L1FBVB900I-ND |
Manufacturer Part#: |
XCZU7EV-L1FBVB900I |
Price: | $ 2.08 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Xilinx Inc. |
Short Description: | IC FPGA 204 I/O 900FCBGA |
More Detail: | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 1.89000 |
Series: | Zynq® UltraScale+™ MPSoC EV |
Packaging: | Tray |
Part Status: | Active |
Architecture: | MCU, FPGA |
Core Processor: | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: | -- |
RAM Size: | 256KB |
Peripherals: | DMA, WDT |
Connectivity: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: | 500MHz, 600MHz, 1.2GHz |
Primary Attributes: | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
Operating Temperature: | -40°C ~ 100°C (TJ) |
Package / Case: | 900-BBGA, FCBGA |
Supplier Device Package: | 900-FCBGA (31x31) |
Number of I/O: | 204 |
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The XCZU7EV-L1FBVB900I is an embedded system-on-chip (SoC) designed for use in industrial and consumer electronic applications. It integrates an advanced microprocessor, FPGA, and dedicated logic into a single package that provides the performance and flexibility needed for today\'s demanding embedded applications. The XCZU7EV-L1FBVB900I is designed to meet the most rigorous industrial and consumer standards and is capable of interfacing with a variety of commonly available hardware peripherals.
The XCZU7EV-L1FBVB900I SoC incorporates a dual-core ARM Cortex-A76 processor and Kyllin GPU core that delivers high-performance computational power and multitasking capabilities. It also features four FPGA channels that are provided for the integration of additional logic and programmable coprocessor blocks, allowing for a range of additional capabilities such as DSP and image processing. The XCZU7EV-L1FBVB900I also supports multi-threading and multi-processing, allowing for the simultaneous execution of multiple threads in order to improve system performance.
The XCZU7EV-L1FBVB900I is also equipped with a wide range of advanced integrated peripherals, including a 16-bit/32-bit timer complex, multiple communication buses such as I2C, SPI, and USB, as well as high-speed memory interfaces including NOR and NAND flash. The XCZU7EV-L1FBVB900I also includes an advanced on-chip system management unit that can be configured to monitor temperature, power and system performance in order to ensure reliable operation.
The XCZU7EV-L1FBVB900I SoC is ideal for embedded applications that require high performance, flexibility and low power consumption. It can be used in a variety of applications such as industrial automation, medical equipment, industrial control, military surveillance and vehicle navigation systems, among others.
The XCZU7EV-L1FBVB900I has a highly efficient architecture that enables the device to be implemented for a variety of applications. It can be configured to support real-time scheduling, DSP and image processing operations, as well as low-power and fast wake up features. The XCZU7EV-L1FBVB900I also supports a unique three-level power optimization feature which allows the device to be tuned to the specific needs of the application while maintaining a low power profile.
The XCZU7EV-L1FBVB900I SoC is designed to be highly reliable and is capable of operating in extreme temperature and power conditions. Its advanced clock and power management features further enhance its performance and reduce system power consumption. Its versatile communications interfaces make it easy to connect with a number of commonly used hardware peripherals. Furthermore, its embedded safety features make it suitable for use in safety-critical applications.
The XCZU7EV-L1FBVB900I SoC is the ideal choice for embedded applications requiring real-time processing, low power management, and advanced connectivity options. By combining a powerful microprocessor, FPGA, and dedicated logic blocks into a single package, the XCZU7EV-L1FBVB900I is capable of delivering the high performance required to meet the demands of today\'s most sophisticated embedded applications.
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