Embedded microcontroller logic ic - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
ZLE38640BADA-ND	ZLE38640BADA	Microsemi Corporation	View more Series: * Part Status: Active Type: * Function: * Utilized IC / Part: * Supplied Contents: Board(s)	1000 Order	1+: $0
MAX3947EVKIT#-N D	MAX3947EVKIT#	Maxim Integrated	View more Series: * Part Status: Obsolete Supplied Contents: Board(s)	1000 Order	1+: $0
OM6285,598-ND	OM6285,598	NXP USA Inc	View more Part Status: Last Time Buy Type: Interface Function: IC Devices Embedded: Yes, MCU, 8-Bit Supplied Contents: Board(s), Power Supply Secondary Attributes: Headers for Access to Each IC	1000 Order	1+: $18.2952
568-4002-ND	OM6278,598	NXP USA Inc	View more Part Status: Obsolete Type: Interface Function: IC Devices Embedded: Yes, MCU, 8-Bit Supplied Contents: Board(s), Cable(s), Power Supply Secondary Attributes: Headers for Access to Each IC	1000 Order	1+: $0
602-1083-ND	CC-9P-CE6	Digi International	View more Series: ConnectCore Part Status: Obsolete Board Type: Evaluation Platform Type: MPU Core Processor: ARM9 Operating System: Windows Embedded CE Platform: Digi JumpStart Kit For Use With/Related Products: NS9360 Mounting Type: Fixed Contents: Board(s), Cable(s), Power Supply	1000 Order	1+: $0
602-1080-ND	CC-9C-CE6	Digi International	View more Series: ConnectCore Part Status: Obsolete Board Type: Evaluation Platform Type: MPU Core Processor: ARM9 Operating System: Windows Embedded CE Platform: Digi JumpStart Kit For Use With/Related Products: NS9360 Mounting Type: Fixed Contents: Board(s), Cable(s), Power Supply	1000 Order	1+: $0
MCIMX35WPDK-ND	MCIMX35WPDK	NXP USA Inc	View more Series: i.MX Part Status: Obsolete Board Type: Evaluation Platform Type: MPU Core Processor: ARM11 Operating System: Windows Embedded CE For Use With/Related Products: i.MX35 Mounting Type: Fixed Contents: Board(s), Cable(s), LCD, Power Supply	1000 Order	1+: $0
MCIMX31WPDK-ND	MCIMX31WPDK	NXP USA Inc	View more Series: i.MX Part Status: Active Board Type: Evaluation Platform Type: MPU Core Processor: ARM11 Operating System: Windows Embedded CE For Use With/Related Products: i.MX31 Mounting Type: Fixed Contents: Board(s)	1000 Order	1+: $0.63
MCIMX51EVKJ-ND	MCIMX51EVKJ	NXP USA Inc	View more Series: i.MX Part Status: Active Board Type: Evaluation Platform Type: MPU Core Processor: ARM Cortex-A8 Operating System: Linux, Windows Embedded CE For Use With/Related Products: i.MX51 Mounting Type: Fixed Contents: Board(s), Cable(s), Power Supply	3 Order	1+: $467.895
DV102014-ND	DV102014	Microchip Technology	View more Series: GestIC Part Status: Active Lead Free Status / RoHS Status: Lead free / RoHS Compliant Sensor Type: Touch, Capacitive Moisture Sensitivity Level (MSL): 1 (Unlimited) Interface: IC Supplied Contents: Board(s), Cable(s)	4 Order	1+: $161.576
1191-1044-ND	EVAL-KX122-1037	Kionix Inc.	View more Part Status: Discontinued at Digi-Key Lead Free Status / RoHS Status: Lead free / RoHS Compliant Sensor Type: Accelerometer, 3 Axis Moisture Sensitivity Level (MSL): 3 (168 Hours) Sensing Range: 2g, 4g, 8g Interface: IC, SPI Voltage - Supply: 1.71 V ~ 3.6 V Supplied Contents: Board(s) Utilized IC / Part: KX122-1037	19 Order	1+: $23.5053
768-1250-ND	UMFT201XA-02	FTDI, Future Technology Devices International Ltd	View more Series: USBmadeEZ-FIFO, FT-X, X-Chip Part Status: Active Type: Interface Function: USB 2.0 to IC Bridge (Slave) Embedded: Yes, ASIC Utilized IC / Part: FT201X Primary Attributes: USB Full Speed, Mini-B Socket, 0.3" Wide 16-Pin DIP Socket Supplied Contents: Board(s) Secondary Attributes: USB Charging Detection	304 Order	1+: $11.8629
768-1115-ND	UMFT201XA-01	FTDI, Future Technology Devices International Ltd	View more Series: USBmadeEZ-FIFO, FT-X, X-Chip Part Status: Obsolete Type: Interface Function: USB 2.0 to IC Bridge (Slave) Embedded: Yes, ASIC Utilized IC / Part: FT201X Primary Attributes: USB Full Speed, Mini-B Socket, 0.3" Wide 16-Pin DIP Socket Supplied Contents: Board(s) Secondary Attributes: USB Charging Detection	1000 Order	1+: $0
768-1207-ND	UMFT201XE-01	FTDI, Future Technology Devices International Ltd	View more Series: USBmadeEZ-FIFO, FT-X, X-Chip Part Status: Active Type: Interface Function: USB 2.0 to IC Bridge (Slave) Embedded: Yes, ASIC Utilized IC / Part: FT201X Primary Attributes: USB Full Speed, Mini-B Socket, 0.6" Wide 16-Pin DIP Socket Supplied Contents: Board(s) Secondary Attributes: USB Charging Detection	5 Order	1+: $11.8629
ROBOTICSDEVKIT- ND	ROBOTICS DEVELO PMENT KIT	Custom Computer Services Inc. (CCS)	View more Series: PIC Part Status: Active Utilized IC / Part: PIC16LF877A	1000 Order	1+: $454.388
QSE157-ND	QSE157	ON Semiconductor	View more Series: OPTOLOGIC Part Status: Obsolete Wavelength: 880nm Type: Photo Detector, Logic Output Output Type: Push-Pull Package / Case: 3-SIP, Side View Operating Temperature: -40C ~ 85C (TA)	1000 Order	1+: $0
QSE159-ND	QSE159	ON Semiconductor	View more Series: OPTOLOGIC Part Status: Active Wavelength: 880nm Type: Photo Detector, Logic Output Output Type: Open Collector Inverter Package / Case: 3-SIP, Side View Operating Temperature: -40C ~ 85C (TA)	10998 Order	1+: $0.6489 10+: $0.5292 100+: $0.3663 500+: $0.2767 1000+: $0.2279
QSE156-ND	QSE156	ON Semiconductor	View more Series: OPTOLOGIC Part Status: Obsolete Wavelength: 880nm Type: Photo Detector, Logic Output Output Type: Push-Pull Package / Case: 3-SIP, Side View Operating Temperature: -40C ~ 85C (TA)	1000 Order	1+: $0
SFH5440-Z-ND	SFH 5440-Z	OSRAM Opto Semiconductors Inc.	View more Part Status: Obsolete Wavelength: 400 ~ 1100nm Type: Photo Detector, Logic Output Output Type: Active Low Package / Case: 3-SMD, Gull Wing Operating Temperature: -40C ~ 85C (TA)	1000 Order	1+: $0
QSE158-ND	QSE158	ON Semiconductor	View more Series: OPTOLOGIC Part Status: Obsolete Wavelength: 880nm Type: Photo Detector, Logic Output Output Type: Open Collector Package / Case: 3-SIP, Side View Operating Temperature: -40C ~ 85C (TA)	1000 Order	1+: $0
QSA159-ND	QSA159	ON Semiconductor	View more Series: OPTOLOGIC Part Status: Obsolete Wavelength: 880nm Type: Photo Detector, Logic Output Output Type: Open Collector Inverter Package / Case: TO-18 small Operating Temperature: -55C ~ 105C (TA)	1000 Order	1+: $0
1176-1019-ND	D072-0103	TPK America LLC	View more Series: OMAP Part Status: Active Board Type: Single Board Computer Type: MPU Core Processor: ARM Cortex-A8 Operating System: Android, Linux Platform: NIMble Embedded Touch Computer For Use With/Related Products: Fusion Touch Display, OMAP3530 Mounting Type: Fixed Contents: Board(s), LCD, Power Supply	3 Order	1+: $0.63
2905504-ND	2905504	Phoenix Contact	View more Series: PLC-V8C Part Status: Obsolete Number of Inputs and Type: 8 - Digital (6), Analog/Digital (2) Number of Outputs and Type: 8 - Relay Expandable: 3 Modules Max Voltage - Supply: 24VDC Display Type: No Display Communications: USB Mounting Type: Chassis Mount Features: Starter Kit: Cable, Controller, Software, Terminal Blocks Operating Temperature: -20C ~ 45C Ingress Protection: IP20 Software: LOGIC+ Weight: 0.309 lb (140.16g)	1000 Order	1+: $0
497-13256-2-ND	ACS108-8SN-TR	STMicroelectronics	View more Series: ACS/A.S.D Packaging: Tape & Reel (TR) Part Status: Active Triac Type: Logic - Sensitive Gate Voltage - Off State: 800V Current - On State (It (RMS)) (Max): 800mA Voltage - Gate Trigger (Vgt) (Max): 1V Current - Non Rep. Surge 50, 60Hz (Itsm): 13A, 13.7A Current - Gate Trigger (Igt) (Max): 10mA Current - Hold (Ih) (Max): 10mA Configuration: Single Operating Temperature: -30C ~ 125C (TJ) Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Supplier Device Package: SOT-223 Base Part Number: ACS108	1000 Order	--
ADSP-BF526BBCZ- 3A-ND	ADSP-BF526BBCZ- 3A	Analog Devices Inc.	View more Series: Blackfin Packaging: Tray Part Status: Active Type: Fixed Point Interface: DMA, Ethernet, IC, PPI, SPI, SPORT, UART, USB Clock Rate: 300MHz Non-Volatile Memory: ROM (32 kB) On-Chip RAM: 132kB Voltage - I/O: 1.8V, 2.5V, 3.3V Voltage - Core: 1.30V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 208-FBGA, CSPBGA Supplier Device Package: 208-CSPBGA (17x17) Base Part Number: ADSP-BF526	277 Order	1+: $13.0851 90+: $11.524 180+: $10.3038
XCZU2CG-2SFVC78 4I-ND	XCZU2CG-2SFVC78 4I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23) Number of I/O: 252	1000 Order	1+: $235.053
XCZU4EV-1FBVB90 0E-ND	XCZU4EV-1FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	--
XCZU9CG-2FFVC90 0E-ND	XCZU9CG-2FFVC90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 599K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.89
XCZU7CG-2FFVC11 56I-ND	XCZU7CG-2FFVC11 56I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 360	1000 Order	1+: $1.89
XCZU11EG-2FFVF1 517I-ND	XCZU11EG-2FFVF1 517I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 653K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40) Number of I/O: 464	1000 Order	--
XCZU5CG-1FBVB90 0E-ND	XCZU5CG-1FBVB90 0E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 256K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $0.63
XCZU17EG-L1FFVD 1760I-ND	XCZU17EG-L1FFVD 1760I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 926K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5) Number of I/O: 308	1000 Order	1+: $3.78
5CSXFC4C6U23A7N -ND	5CSXFC4C6U23A7N	Intel FPGAs/Altera	View more Series: Automotive, AEC-Q100, Cyclone V SE Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 40K Logic Elements Operating Temperature: -40C ~ 125C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23) Number of I/O: MCU - 181, FPGA - 145	1000 Order	60+: $139.206
XCZU7EG-1FFVC11 56E-ND	XCZU7EG-1FFVC11 56E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 360	1000 Order	1+: $1.26
122-2060-ND	XCZU15EG-L1FFVC 900I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 747K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	5 Order	1+: $2.52
122-2017-ND	XA7Z020-1CLG484 Q	Xilinx Inc.	View more Series: Automotive, AEC-Q100, Zynq-7000 XA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix-7 FPGA, 85K Logic Cells Operating Temperature: -40C ~ 125C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19x19) Number of I/O: 130	148 Order	1+: $96.642
XCZU15EG-2FFVB1 156I-ND	XCZU15EG-2FFVB1 156I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 747K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Number of I/O: 328	1000 Order	--
XCZU2CG-L2SFVA6 25E-ND	XCZU2CG-L2SFVA6 25E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC CG Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 103K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21) Number of I/O: 180	1000 Order	1+: $228.501
XCZU4EV-L2FBVB9 00E-ND	XCZU4EV-L2FBVB9 00E	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 600MHz, 1.3GHz Primary Attributes: ZynqUltraScale+ FPGA, 192K+ Logic Cells Operating Temperature: 0C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26
XCZU7EV-1FBVB90 0I-ND	XCZU7EV-1FBVB90 0I	Xilinx Inc.	View more Series: Zynq UltraScale+ MPSoC EV Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARMCortex-R5 with CoreSight, ARM Mali-400 MP2 RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 600MHz, 1.2GHz Primary Attributes: ZynqUltraScale+ FPGA, 504K+ Logic Cells Operating Temperature: -40C ~ 100C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Number of I/O: 204	1000 Order	1+: $1.26

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