Microcontroller 128k flash memory chip

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
0W635-006-XTP-N D	0W635-006-XTP	ON Semiconductor	View more Part Status: Active	1000 Order	1+: $0
1100-1003-ND	A2F200M3F-FGG25 6	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F200	1000 Order	1+: $0
1100-1007-ND	A2F500M3G-1FGG2 56	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	1+: $0
1100-1001-ND	A2F200M3F-1FGG4 84	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: MCU - 41, FPGA - 94 Base Part Number: A2F200	1000 Order	--
1100-1010-ND	A2F500M3G-FGG48 4	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: MCU - 41, FPGA - 128 Base Part Number: A2F500M3G	1000 Order	1+: $40.7295 10+: $38.3342 100+: $34.2612
1100-1002-ND	A2F200M3F-1PQG2 08	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28) Number of I/O: MCU - 22, FPGA - 66 Base Part Number: A2F200	1000 Order	1+: $0
1100-1005-ND	A2F200M3F-PQG20 8	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28) Number of I/O: MCU - 22, FPGA - 66 Base Part Number: A2F200	1000 Order	--
1100-1000-ND	A2F200M3F-1FGG2 56	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F200	1000 Order	1+: $0
1100-1009-ND	A2F500M3G-FGG25 6	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17) Number of I/O: MCU - 25, FPGA - 66 Base Part Number: A2F500M3G	1000 Order	--
1100-1008-ND	A2F500M3G-1FGG4 84	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: MCU - 41, FPGA - 128 Base Part Number: A2F500M3G	22 Order	1+: $44.9694 10+: $42.2434 100+: $38.1553
1100-1004-ND	A2F200M3F-FGG48 4	Microsemi Corporation	View more Series: SmartFusion Packaging: Tray Part Status: Discontinued at Digi-Key Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: MCU - 41, FPGA - 94 Base Part Number: A2F200	1000 Order	--
XC7Z035-1FFG900 C-ND	XC7Z035-1FFG900 C	Xilinx Inc.	View more Series: Zynq-7000 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA	1000 Order	--
M2S060TS-1FG484 M-ND	M2S060TS-1FG484 M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Number of I/O: 267	1000 Order	60+: $175.339
M2S060T-1FGG676 -ND	M2S060T-1FGG676	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $78.1767
M2S010S-TQG144- ND	M2S010S-TQG144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Number of I/O: 84	1000 Order	60+: $20.9765
M2S010S-1TQG144 -ND	M2S010S-1TQG144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Number of I/O: 84	1000 Order	60+: $23.4965
M2S060T-1FGG484 M-ND	M2S060T-1FGG484 M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $159.393
M2S010S-1TQG144 I-ND	M2S010S-1TQG144 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 84	1000 Order	60+: $26.0064
M2S010S-TQ144I- ND	M2S010S-TQ144I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 84	1000 Order	60+: $23.4965
1100-1296-ND	M2S010S-TQ144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: Module Supplier Device Package: Module Number of I/O: 84	1000 Order	60+: $20.9765
M2S090-1FG676IX 417-ND	M2S090-1FG676IX 417	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 425	1000 Order	1+: $0
M2S010S-1TQ144- ND	M2S010S-1TQ144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Number of I/O: 84	1000 Order	60+: $23.4965
M2S060TS-1FGG48 4M-ND	M2S060TS-1FGG48 4M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $175.339
M2S010S-TQG144I -ND	M2S010S-TQG144I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 84	1000 Order	60+: $23.4965
M2S010S-1TQ144I -ND	M2S010S-1TQ144I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 84	1000 Order	60+: $26.0064
M2S060T-1FG484M -ND	M2S060T-1FG484M	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -55C ~ 125C (TJ) Number of I/O: 267	1000 Order	60+: $159.393
10AS027H4F35E3S G-ND	10AS027H4F35E3S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Number of I/O: 384	1000 Order	3+: $591.572
10AS027E2F29E2S G-ND	10AS027E2F29E2S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Number of I/O: 360	1000 Order	3+: $0.63
M2S010S-1VFG400 I-ND	M2S010S-1VFG400 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 195 Base Part Number: M2S010S	1000 Order	1+: $0
1100-1196-ND	M2S025-FGG484I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	78 Order	1+: $52.2648 10+: $48.9982 100+: $44.0984
M2S010-TQ144I-N D	M2S010-TQ144I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Last Time Buy Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $20.2608
1100-1219-ND	M2S010-VFG400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 195 Base Part Number: M2S010	1000 Order	90+: $21.793
M2S010-1VFG256I -ND	M2S010-1VFG256I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $23.899
M2S090TS-FCS325 I-ND	M2S090TS-FCS325 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $92.3419
10AS022C4U19E3S G-ND	10AS022C4U19E3S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 220K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Number of I/O: 192	1000 Order	3+: $313.742
10AS032E4F29I3S G-ND	10AS032E4F29I3S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 360	1000 Order	3+: $0.63
10AS027E4F29I3L G-ND	10AS027E4F29I3L G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 360	1000 Order	3+: $0.63
10AS027H3F35I2S G-ND	10AS027H3F35I2S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: -40C ~ 100C (TJ) Number of I/O: 384	1000 Order	3+: $0.63
M2S010-VF400-ND	M2S010-VF400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 195 Base Part Number: M2S010	1000 Order	90+: $21.793
10AS032H2F34E2S G-ND	10AS032H2F34E2S G	Intel FPGAs/Altera	View more Series: Arria 10 SX Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: Dual ARM Cortex-A9 MPCore with CoreSight RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, IC, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0C ~ 100C (TJ) Number of I/O: 384	1000 Order	3+: $0.63

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