0097052019 Allicdata Electronics
Allicdata Part #:

0097052019-ND

Manufacturer Part#:

0097052019

Price: $ 10.72
Product Category:

RF/IF and RFID

Manufacturer: Laird Technologies EMI
Short Description: AP,STR,NIB,PSA
More Detail: N/A
DataSheet: 0097052019 datasheet0097052019 Datasheet/PDF
Quantity: 1000
100 +: $ 9.74645
Stock 1000Can Ship Immediately
$ 10.72
Specifications
Series: --
Part Status: Active
Type: Fingerstock
Shape: --
Width: 0.370" (9.40mm)
Length: 16.000" (406.40mm)
Height: 0.140" (3.56mm)
Material: Beryllium Copper
Plating: Nickel
Plating - Thickness: 299.21µin (7.60µm)
Attachment Method: Adhesive
Operating Temperature: 121°C
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

RFI and EMI – Contacts, Fingerstock and Gaskets

Electro magnetic interference (EMI) and radio frequency interference (RFI) are both types of electromagnetic signals that emit from an electrical device. This interference can have unwanted side effects; such as disrupting normal signals, reducing the performance of other devices, or even creating physical damage or bodily harm in extreme cases.

In order to reduce or even prevent this interference, manufacturers rely on contact surfaces and materials made from EMI and RFI shielding metals. These materials help to create a more electrically secure environment, which ultimately helps to work the functioning of all electrical components and systems. Contact surfaces and materials may include fingerstock, gaskets and contacts. These materials are specifically designed to reduce and/or block EMI and RFI interference.

One of the most reliable solutions for EMI and RFI mitigation is the use of fingerstock. Fingerstock is a type of metal alloy that helps to reduce the effect of electromagnetic radiation. It consists of a variety of conductive metals, like copper, nickel, and tin, as well as some insulating coatings. The contact surfaces of electrical components have tiny fingers (hence the name “fingerstock”), which act as a “cross-connecting” barrier to shield the device from EMI and RFI interference. Fingerstock works by providing both electrical insulation and a physical barrier, which helps to contain and reduce unwanted electromagnetic radiation.

Gaskets are also a reliable solution for EMI and RFI shielding. Gaskets are made from materials that can reduce or block the transmission of unwanted EMI and RFI signals from entering or leaving the device, as well as radiating from the device itself. Some of the materials used to manufacture gaskets include copper, nickel, stainless steel, terrylene and Neoprene. These materials all assist with controlling and blocking EMI and RFI signals. In addition, some of these materials also provide additional benefits like vibration damping, thermal insulation, and waterproofing. Gaskets are the ideal solution for creating a reliable electromagnetically secure environment.

Contacts are also used to reduce and/or block EMI and RFI signals. Contacts, which are usually made of metal, are installed at the interface of two components. The contacts act as a barrier between the two components, which helps to reduce the transmission of unwanted electromagnetic signals from one component to another. In addition, contacts also help to electrically isolate the two components, which helps to reduce the chances of EMI and RFI interference. Contacts are often used in the design of electronic equipment to ensure the efficient and reliable functioning of its components.

By using contact surfaces, fingerstock and gaskets, manufacturers are able to reduce the effect of RFI and EMI emissions. These materials provide a reliable way to create a more electromagnetically secure environment, which ultimately helps to ensure the optimal performance of all electrical components and systems. Manufacturers must ensure that these materials are used in the proper quantity and quality in order to reduce the chances of EMI and RFI emissions and create a more secure electro-magnetic environment.

The specific data is subject to PDF, and the above content is for reference

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