0097064002

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RFI and EMI contacts, fingerstock and gaskets are integral components of RF / EM interface systems. This article will look at the application fields and working principles of 0097064002 - an on-chip, high current RF / EMI contact system.

The 0097064002 contact system is designed for achieving robust RF / EMI performance on a variety of surfaces, including PC boards, substrates and bare die. Its high current carrying capacity makes it well suited for applications involving high power operations. The system is also designed to provide consistent electrical continuity on a wide range of surfaces, including metallized circuits, ceramic packages, handheld devices, semiconductors and PCBs.

The 0097064002 contact system consists of two components: an electroless plated contact pad and an embedded contact finger which is connected using a high precision spring system. The contact pad is made from a low-carbon steel, and the contact finger is made from copper that is laser-engraved to form a precise contact pattern. The contact pad and contact finger are then mated together using a specialized vacuum deposition of gold or palladium depending on the application. The resulting contact system is designed to provide a firm, yet reliable electrical connection.

When used in a RF / EMI application, the 0097064002 contact system provides a reliable, low leakage interface that is resistant to corrosion and other environmental factors. This type of contact system is also designed to provide a low-inductance, low-capacitance connection between the two components, allowing for higher power levels and greater efficiency. Additionally, this type of contact system can be installed in applications that require a high degree of precision. The contact system is also designed to provide low-power losses even when used in high-frequency applications.

The 0097064002 contact system is designed to be used in a wide range of applications. It can be used for a variety of RF / EMI related tasks, such as shielding, grounding, galvanic isolation, RF power conditioning, and coupling. It is also suitable for applications that require high-precision connections in order to maintain signal integrity. The contact system can also be used in a number of high-speed applications such as in on-board Ethernet and USB connectors.

In conclusion, the 0097064002 contact system is an excellent choice for RF / EMI applications that require a reliable, low leakage interface and high precision connections for both power and signal integrity. Its high current carrying capacity makes it ideal for applications involving high power levels. Its design also allows for low-inductance and low-capacitance connections to maintain signal integrity. Furthermore, its durability makes it suitable for both high-speed and low-speed applications. In short, the 0097064002 contact system is an excellent choice for applications requiring reliable and robust RF / EMI performance.

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