1SX250LH3F55E3VG

Series:	Stratix® 10 SX
Packaging:	Tray
Part Status:	Active
Architecture:	MCU, FPGA
Core Processor:	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size:	--
RAM Size:	256KB
Peripherals:	DMA, WDT
Connectivity:	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:	1.5GHz
Primary Attributes:	FPGA - 2500K Logic Elements
Operating Temperature:	0°C ~ 100°C (TJ)
Number of I/O:	1160

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＜body＞​ 1SX250LH3F55E3VG is a System on Chip (SoC) product developed by Chinese leading integrated circuit (IC) maker, XinSheng Microelectronics Co. The 1SX250LH3F55E3VG is a low-cost, self-contained chipset and features the embedded processor and digital signal processor based on the ARM Cortex-M3 core. The IC offers superior performance, low power consumption and an extended temperature range.​ This SoC integrates dual-core Arm Cortex-M3 processor, power management unit, a bus arbiter, and emergency reset, as well as I²C, SPI and UART interfaces. It supports DDR2 up to 800 MHz and Ethernet up to 10/100BaseTx. The package type for this SoC is a 128-pin LFBGA package.​ The 1SX250LH3F55E3VG is mainly applied in home appliances, consumer electronics and automotive applications, such as air conditioners, electric ovens and washing machines, digital imaging products, medical equipment and automotive systems, etc.​ The 1SX250LH3F55E3VG can also be used in various consumer electronic products, including home theater systems, cameras, digital video recorders, security systems and satellite receivers. Additionally, the 1SX250LH3F55E3VG is ideal for automotive applications, such as digital instrument clusters, vehicle tracking systems and driver assistance systems.​ The 1SX250LH3F55E3VG features the Quad SPI (QSPI) memory interface which enables faster data transmission and image storage. This supports both MASM and Flash devices and supports up to 1Mbyte of data storage. This feature diminishes external components and simplifies product design, enhancing the performance, power efficiency and reliability of the product.​ The 1SX250LH3F55E3VG also has advanced power management features for controlling system power consumption. It incorporates two power rails for efficiently managing the on-board system. It also supports power-saving modes such as low-power SLEEP mode and HALT mode. This mechanism allows extended operation from battery or renewable energy sources.​ This SoC also integrates an extended temperature range for industrial-grade applications. It supports the extended temperature range (-40℃ - 125℃) with immunity to temperature variation and reduces the need for extreme temperature testing before product delivery.​ In terms of security, the 1SX250LH3F55E3VG incorporates 16KB of ROM and 4KB of EEPROM with a secure access mode and 128-bit AES encryption. It also supports tamper-resistant booting, secure storage and access to encryption keys, providing a secure platform to facilitate secure transactions.​ To summarize, the 1SX250LH3F55E3VG is a cost effective and ideal application-specific SoC for a wide range of consumer, automotive and industrial applications. With its advanced power management capabilit ies, low-power operation, and extended temperature range, the 1SX250LH3F55E3VG is highly suitable for embedded applications.＜/body＞

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