1SX250LH3F55I1VG Allicdata Electronics
Allicdata Part #:

1SX250LH3F55I1VG-ND

Manufacturer Part#:

1SX250LH3F55I1VG

Price: $ 17.33
Product Category:

Integrated Circuits (ICs)

Manufacturer: Intel FPGAs/Altera
Short Description: 2912-PIN FBGA
More Detail: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Syst...
DataSheet: 1SX250LH3F55I1VG datasheet1SX250LH3F55I1VG Datasheet/PDF
Quantity: 1000
3 +: $ 15.75000
Stock 1000Can Ship Immediately
$ 17.33
Specifications
Series: Stratix® 10 SX
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2500K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Number of I/O: 1160
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Embedded System On Chip (SoC) is a powerful technology that is becoming increasingly popular in both the consumer and industrial market. One example of the use of this technology is the 1SX250LH3F55I1VG application field, which is designed to provide a storage solution for applications such as digital cameras, video cameras, digital video recorder (DVR) systems, and other embedded devices.

The 1SX250LH3F55I1VG application field utilizes a multi-core processor and efficient system design to provide a powerful storage solution with excellent performance and reliability. The device is designed to be powered by an external power supply, with an internal memory of up to 32GB. The device also features a host controller for connecting to the host system and the data bus. This allows for the communication of the device with other components, as well as providing a reliable platform for the storage of data.

In addition to its storage capabilities, the 1SX250LH3F55I1VG application field also provides a host of other features such as a security layer, which helps protect the data stored on the device, and power management capabilities. One of the most noteworthy features of the device is its ability to operate in a variety of environments, such as extreme temperatures and altitudes. This device has been tested and proven to work in a range of environments, from the coldest climates to the hottest, as well as in areas exposed to intense radiation. The device is also capable of handling low power consumption, making it perfect for mobile applications.

The working principle of the 1SX250LH3F55I1VG application is rooted in its use of a multi-core processor. This processor acts as the central processing unit (CPU) and is responsible for processing tasks and data, as well as providing communication between the various components within the device. The multi-core processor allows the device to quickly and accurately process large amounts of data, while also providing a powerful storage solution. In addition to this, the device is also able to utilize its memory and storage capabilities to provide a wide range of applications and functions.

The 1SX250LH3F55I1VG application field is designed to be highly reliable and efficient, while still providing excellent performance. The device is designed to meet the needs of a wide range of applications, and is capable of handling large amounts of data in a short period of time. This makes the device an ideal choice for applications that require high performance and reliability. Additionally, the device features a number of other features such as power management capabilities, security layers, and other features that make it an attractive option for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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