1SX280LH3F55E2LG Allicdata Electronics
Allicdata Part #:

1SX280LH3F55E2LG-ND

Manufacturer Part#:

1SX280LH3F55E2LG

Price: $ 17.33
Product Category:

Integrated Circuits (ICs)

Manufacturer: Intel FPGAs/Altera
Short Description: 2912-PIN FBGA
More Detail: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Syst...
DataSheet: 1SX280LH3F55E2LG datasheet1SX280LH3F55E2LG Datasheet/PDF
Quantity: 1000
3 +: $ 15.75000
Stock 1000Can Ship Immediately
$ 17.33
Specifications
Series: Stratix® 10 SX
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Number of I/O: 1160
Description

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Embedded System on Chip (SoC) is a combination of a number of integrated circuits, or "modules," that form an individual system of operation. It is a single-chip solution that consists of a processor, memory, storage, and peripherals all integrated on the same chip. The 1SX280LH3F55E2LG chip is an example of SoC technology that is utilized in many different applications, ranging from industrial to consumer electronics.

The 1SX280LH3F55E2LG chip is based on ARM Cortex A9 RISC microprocessor and runs at 1GHz frequency. It is designed to be a general-purpose SoC, capable of performing a variety of tasks. The chip contains an external memory controller, an integrated 2D/3D graphics accelerator, multiple external bus interfaces, and a 64-bit AXI bus bridge. It also supports up to 4GB of RAM and an embedded Flash memory with a 32KB minimum size. Other features include an Ethernet controller, an internal reset circuit, as well as a boot-loader.

The 1SX280LH3F55E2LG chip is commonly used in a variety of applications, including embedded control, industrial automation, automotive, HMI (Human Machine Interfaces), and consumer electronic products. In addition, the chip is ideal for use in medical and healthcare devices, such as either portable or implantable devices. The chip’s features and performance make it well-suited for applications requiring power-efficient solutions with low latency operations, such as medical imaging and real-time video processing.

The 1SX280LH3F55E2LG chip is built on the ARM Cortex-A9 architecture, which is a high-performance, multi-core processor. The chip includes an integrated ARM AMBA AXI interconnect, which provides a high-speed data exchange between the processor cores, RAM, memory controller, and the peripheral interfaces. The integrated 2D/3D graphics accelerator enables fast, low-latency processing of graphics data, while the integrated Ethernet controller allows for high-speed data access.

In addition to the processor and memory components, the 1SX280LH3F55E2LG chip also includes a variety of peripheral interfaces and external bus capabilities. Among the interfaces available are four UART (Universal Asynchronous Receiver/Transmitter), four SPI (Serial Peripheral Interface), four I2C (Inter-Integrated Circuit), four CAN (Controller Area Network), one USB 2.0 port, and two 32-bit 3.2V Data Bus. These interfaces enable the chip to function as a high-speed serial link between various devices, as well as to provide access to multiple peripheral devices. Additionally, the chip supports up to four external bus interfaces, allowing it to communicate with either external chips or devices.

The 1SX280LH3F55E2LG chip utilizes a 32-bit RISC architecture, allowing it to maximize the efficiency of the instruction sets in order to achieve high performance. The chip also includes an external memory controller, which allows for fast and efficient access to external RAM and Flash memory. The integrated AXI bus bridge also ensures fast and efficient data transfer between the processor and its peripherals.

The 1SX280LH3F55E2LG chip is a perfect solution for applications requiring low power and high performance, as well as for interfacing with various external devices. This combined with its multiple peripheral interfaces, Ethernet, and integrated 2D/3D graphics makes it an ideal choice for a variety of embedded, industrial, and consumer electronics applications.

The specific data is subject to PDF, and the above content is for reference

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