71V124SA10YG Allicdata Electronics
Allicdata Part #:

71V124SA10YG-ND

Manufacturer Part#:

71V124SA10YG

Price: $ 1.17
Product Category:

Integrated Circuits (ICs)

Manufacturer: IDT, Integrated Device Technology Inc
Short Description: IC SRAM 1M PARALLEL 32SOJ
More Detail: SRAM - Asynchronous Memory IC 1Mb (128K x 8) Paral...
DataSheet: 71V124SA10YG datasheet71V124SA10YG Datasheet/PDF
Quantity: 1000
575 +: $ 1.05972
Stock 1000Can Ship Immediately
$ 1.17
Specifications
Series: --
Packaging: Tube 
Part Status: Active
Memory Type: Volatile
Memory Format: SRAM
Technology: SRAM - Asynchronous
Memory Size: 1Mb (128K x 8)
Write Cycle Time - Word, Page: 10ns
Access Time: 10ns
Memory Interface: Parallel
Voltage - Supply: 3.15 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-BSOJ (0.400", 10.16mm Width)
Supplier Device Package: 32-SOJ
Base Part Number: IDT71V124
Description

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The 71V124SA10YG is a specialty dynamic random access memory (DRAM) designed specifically for device applications. It is optimized for high density and low power consumption, and features a wide range of features, including ECC, staggered burst lengths, data-lane-fault detection and correction, and open-column write.

The 71V124SA10YG is a dual-bank architecture based on a 32K x 8 organization, supporting 128Kbit of total memory space. It operates with a 3.3V supply voltage and is capable of accommodating up to 10,000 cycles per second. The wide range of operating temperature and voltage conditions makes this device ideal for use in industrial and automotive applications, as well as in aerospace and defense.

The 71V124SA10YG can be used for both read and write operations, allowing for simultaneous accesses to both banks of memory without suffering from a reduced speed penalty. ECC is provided for both banks, and data lane fault detection and correction are implemented for the write bank. Data burst lengths up to 8 frames can be accommodated, providing flexibility and speed performance. To ensure reliability, data is spread across multiple columns of memory, improving the device\'s noise immunity.

When it comes to write operations, the 71V124SA10YG uses an open-column write technique. This method utilizes an asynchronous write command in order to perform faster write operations than other technologies. It also eliminates the need for additional control signals, which reduces system complexity and power consumption. The open-column write technique also aids in error correction, ensuring that all write operations are successful.

The 71V124SA10YG\'s wide range of features makes it an ideal choice for various applications, such as FPGAs, SoCs, DSPs, and embedded controllers. For example, it can be used to provide non-volatile storage within embedded systems. Furthermore, its ability to withstand extreme temperatures of up to +125°C makes it suitable for automotive or industrial applications.

Overall, the 71V124SA10YG DRAM is a high-performance, low-power device designed for applications requiring reliable and fast data storage. With ECC, data-lane-fault detection and correction, staggered burst lengths, and open-column write, this device is extremely versatile and capable of meeting the most demanding requirements of any system.

The specific data is subject to PDF, and the above content is for reference

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