APA750-BGG456I Allicdata Electronics
Allicdata Part #:

APA750-BGG456I-ND

Manufacturer Part#:

APA750-BGG456I

Price: $ 0.69
Product Category:

Integrated Circuits (ICs)

Manufacturer: Microsemi Corporation
Short Description: IC FPGA 356 I/O 456BGA
More Detail: N/A
DataSheet: APA750-BGG456I datasheetAPA750-BGG456I Datasheet/PDF
Quantity: 1000
24 +: $ 0.63000
Stock 1000Can Ship Immediately
$ 0.69
Specifications
Series: ProASICPLUS
Part Status: Active
Total RAM Bits: 147456
Number of I/O: 356
Number of Gates: 750000
Voltage - Supply: 2.3 V ~ 2.7 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 456-BBGA
Supplier Device Package: 456-PBGA (35x35)
Base Part Number: APA750
Description

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APA750-BGG456I, an embedded Field Programmable Gate Array (FPGA), is a semiconductor device consisting of combinatorial and sequential logic that can be changed and reprogrammed to realize different digital functions. It offers significant advantages over traditional logic, such as shorter development time, lower power consumption, faster clock rates and lower costs.

Embedded FPGAs are designed to integrate into an overall system rather than replace the system’s existing logic. These FPGAs offer many advantages over ASICs, including reconfigurability, modularity, on-chip debugging and in-circuit reprogramming. These advantages help reduce the time it takes to bring products to market.

The APA750-BGG456I is a high-end, mid-range embedded FPGA configured as a flexible, scalable multiprocessing system. It offers a wide range of on-chip peripherals, such as DDR3, PCIe, Ethernet, HDMI, USB, HSN and audio interfaces. Its on-chip peripherals and high-speed I/O pins enable the APA750-BGG456I to act as a bridge between devices and subsystems.

The APA750-BGG456I FPGA has a large logic capacity, a low gate-to-gate propagation time and dedicated ARM Cortex-M4 and RISC-V based processors for real-time capabilities. Moreover, it supports small-scale integration of SerDes and digital and analog peripherals, along with embedded nonvolatile memory support, enabling the development and deployment of a wide range of systems.

The APA750-BGG456I also features power management and containment capabilities, offering users the flexibility to adjust the power usage and reduce heat buildup, while also providing greater reliability in operating temperature ranges by using enhanced temperature protection. The FPGA also comes with extended scan testing, enabling the device to be tested faster and at lower costs.

To summarize, APA750-BGG456I is an embedded Field Programmable Gate Array (FPGA) with a wide range of on-chip peripherals, a low gate-to-gate propagation time and advanced power management capabilities. Its wide range of features and capabilities make it an ideal choice for applications that require powerful processing in an economical package.

The specific data is subject to PDF, and the above content is for reference

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