APR19-19-21CB/A01

Series:	APR
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	0.732" (18.60mm)
Width:	0.732" (18.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.811" (20.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.90°C/W @ 200 LFM
Thermal Resistance @ Natural:	14.53°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat SinksThermal-heat sinks are a type of component used to reduce the temperature of an electronic device by dissipation of heat. Generally, the purpose of an electronic thermal-heat sink is to keep the device running at an optimal temperature. Thermal-heat sinks are commonly used in various types of electronic devices from personal and business computers, to embedded microcontrollers and other complex systems.The APR19-19-21CB/A01 thermal-heat sink is a passive cooling product commonly used in a variety of electronic components and systems. Its most basic components consist of a thermally conductive aluminum base, copper heat pipes, aluminum heat sink fins, and thermal interfaces. The thermal-heat sink is designed to dissipate heat generated by an electronic component\'s operation through convection (the transfer of heat from one region to another by the action of air currents), and conduction (the transfer of heat from one element to another by physical contact).The thermal-heat sink’s aluminum base acts as a heat spreader and is designed to improve the overall thermal performance of the device. The copper heat pipes are responsible for transferring heat away from the processor and other components. The aluminum fins, on the other hand, promote thermal dissipation and dissipate heat to the surrounding environment. Finally, thermal interfaces are used to create connection between the electronic components and the thermal-heat sink.The thermal-heat sink is designed to maintain a suitable temperature for a processor or other electronic component by transferring heat away from the device. This is accomplished through the use of copper heat pipes, aluminum heat-sinking fins, and an effective thermal interface. Its high quality construction ensures optimal performance and reduces the risk of excessive heat generated by the electronic component.Overall, the APR19-19-21CB/A01 thermal-heat sink is an effective and efficient way of reducing the temperature of an electronic device. It is designed to work with a variety of components, and can be quickly and easily installed in situations where improved thermal performance is necessary. Its well-constructed design ensures that there is minimal thermal resistance and low system temperatures ensuring that the device remains operational.

The specific data is subject to PDF, and the above content is for reference

Part Number	Manufacturer	Price	Quantity	Description