Allicdata Part #: | APR19-19-33CB/A01-ND |
Manufacturer Part#: |
APR19-19-33CB/A01 |
Price: | $ 4.14 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK FORGED BLK ANO TOP MNT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | APR19-19-33CB/A01 Datasheet/PDF |
Quantity: | 1000 |
100 +: | $ 3.75890 |
Series: | APR |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 0.732" (18.60mm) |
Width: | 0.732" (18.60mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.283" (32.60mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 4.71°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 12.45°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal technology has come a long way since it first emerged, with steady improvements being made over time. The use of thermal solutions in various industries have made many operations more efficient and cost-effective, and one of the more recent advancements is the use of the APR19-19-33CB/A01. This technology stands to revolutionize the realms of heat dissipation and thermal management, with optimized performance and reliability in a wide range of applications.
The APR19-19-33CB/A01 is a highly advanced form of heat sink that has been developed to enable optimal heat dissipation in a range of applications. It features a sophisticated aluminum base with a minimal deformable dielectric sheet that can easily be applied directly to a variety of surfaces like metal, plastic and organic materials, without the need for bonding. The resulting heat spreader works to keep components cooler during use, reducing the risk of overheating and its associated problems.
The inner workings of the APR19-19-33CB/A01 are based on a patented design that uses a specially designed combination of dielectric materials and other components to create an efficient heat sink. This technology is designed to redirect heat away from key components, quickly dissipating it back into the environment. The design of the APR19-19-33CB/A01 features an optimized aluminum base that continues to be efficient even under high temperatures.
The APR19-19-33CB/A01 heat sink works especially well in applications where high levels of heat are generated such as industrial equipment, medical devices, consumer electronics, and automotive applications. This solution has been tested under a range of conditions and proven to offer optimal performance, being able to dissipate a maximum of 34.32 psig of thermal energy into the surrounding environment. It also offers excellent thermal conductivity, making it ideal for environments where large amounts of heat need to be quickly removed.
The APR19-19-33CB/A01 is highly versatile and can be tailored to meet the needs of many different applications. This solution can be used both indoors and out, with the flexibility to handle differing levels of thermal energy without losing efficiency. The temperature range of this solution can manage from -40°C to 150°C, making it possible to keep components from overheating even in extreme temperatures.
Overall, the APR19-19-33CB/A01 is a highly efficient heat sink solution that stands to revolutionize the way that heat dissipation and thermal management is handled across various industries. By utilizing its unique and sophisticated combination of dielectric materials, the APR19-19-33CB/A01 offers superior performance and reliability in a range of applications. With its efficient performance, robust tolerance capabilities, and extended life expectancy, this heat sink solution provides an affordable and economic answer to a range of thermal management needs.
The specific data is subject to PDF, and the above content is for reference
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