Allicdata Part #: | APR19-19-23CB/A01-ND |
Manufacturer Part#: |
APR19-19-23CB/A01 |
Price: | $ 3.86 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK FORGED BLK ANO TOP MNT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | APR19-19-23CB/A01 Datasheet/PDF |
Quantity: | 1000 |
100 +: | $ 3.50986 |
Series: | APR |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins |
Length: | 0.732" (18.60mm) |
Width: | 0.732" (18.60mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.890" (22.61mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 5.58°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 14.19°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
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Thermal - Heat Sinks
Heat sinks are used to help dissipate heat generated by electrical or electronic components. They are also used to transfer heat from two surfaces, either by direct contact or an air gap. Heat sinks provide a large surface area for the transfer of heat from the component to the surrounding air. They are a commonly used component in the electronics industry and have been used for decades.
APR19-19-23CB/A01 Specifications
The APR19-19-23CB/A01 heat sink is a standard, aluminum-based extruded heat sink that is designed to dissipate heat from electrical and electronic components. The extruded design provides superior heat dissipation capabilities and superior structural integrity compared to other heat sink designs. The aluminum base of the heat sink is coated with a protective layer of black oxidized zinc for corrosion resistance. The heat sink also features four integrated mounting slots for easy installation. The APR19-19-23CB/A01 heat sink has a thermal resistance of 0.1K/W and a maximum air gap of 2mm.
Application Field
Heat sinks are commonly used in application fields such as computers, servers, networking equipment, gaming consoles, and industrial equipment. The APR19-19-23CB/A01 heat sink is ideal for applications where a small form factor is required, but with high thermal performance. It is designed to operate in temperatures up to 105 ºC and is suitable for operations in an ambient environment of up to 50 ºC. The APR19-19-23CB/A01 is an ideal solution for applications requiring cooling capacity in confined spaces.
Working Principle
The working principle of a heat sink is to increase the surface area of the component that is generating heat. Heat is dissipated when it is transferred from the hot component to the surface of the heat sink. The increased surface area of the heat sink increases the amount of heat that can be dissipated. Heat is transferred to the surrounding air through convection. Airflow is created over the surface of the heat sink when air is drawn in from the sides. This airflow helps dissipate heat from the component to the surrounding air.
The APR19-19-23CB/A01 heat sink is a standard aluminum-based extruded heat sink. The aluminum base is coated with a black oxidized zinc to provide corrosion resistance. The heat sink also features four integrated mounting slots for easy installation. The extruded design provides superior heat dissipation and structural integrity compared to other heat sink designs. This type of heat sink is ideal for applications requiring cooling capacity in confined spaces.
Conclusion
The APR19-19-23CB/A01 heat sink is an ideal general-purpose heat sink for applications requiring an efficient and reliable solution. It provides superior thermal performance and is suitable for operation in an ambient temperature up to 105ºC. The heat sink has a thermal resistance of 0.1K/W and a maximum air gap of 2mm. It also features four integrated mounting slots for easy installation. The integrated mounting slots make the APR19-19-23CB/A01 an attractive solution for applications requiring cooling capacity in confined spaces.
The specific data is subject to PDF, and the above content is for reference
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