APR19-19-28CB/A01

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Thermal – Heat Sinks are an essential component of any electronic device. Without them, the extreme heat generated by the electronic components during operation would be unable to escape and cause the device to become too hot to operate efficiently, or even suffer permanent damage. The APR19-19-28CB/A01 heat sink is an excellent choice for providing effective thermal management in any electronic device.

The APR19-19-28CB/A01 measures 28mm in diameter and 152mm in height. It is constructed from aluminum alloy and features a high density fin structure that gives the heat sink very good heat dissipation performance. The curvature of the fins also helps to increase the surface area of the heat sink for enhanced cooling properties. The surface of the APR19-19-28CB/A01 is designed to be flat and it also features four threaded M3 mounting holes in its base for easy installation. Finally, the heat sink weighs in at just 80 grams, making it extremely lightweight and suitable for a variety of applications.

As well as having excellent heat dissipation qualities, the APR19-19-28CB/A01 is also designed to be incredibly reliable and robust. Its aluminum alloy composition is extremely resistant to corrosion and this makes it well-suited for use in a variety of different environments. The heat sink is also rated to operate between -40°C to +105°C, making it well-suited for a wide range of applications.

The APR19-19-28CB/A01 is designed to operate by convection. Through a process known as convection, the air surrounding the heat sink is heated as it passes over the surface of the heat sink. As the air begins to get hotter, it becomes less dense and rises, creating a draft which pulls in cooler air that passes over the heat sink and is in turn heated as the cycle continues. This process continues, allowing the electronic device to stay cool while it is being operated.

The APR19-19-28CB/A01 heat sink is an ideal choice for cooling electronics of all sizes. Its lightweight and robust construction make it well-suited to a variety of different applications. The high density fin structure of the heat sink gives it excellent thermal dissipation properties and it is capable to operating in temperatures ranging from -40°C to +105°C. The APR19-19-28CB/A01 is also highly reliable and is an excellent choice for any electronic device in need of effective and efficient thermal management.

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