APR43-43-33CB/A01 Allicdata Electronics
Allicdata Part #:

APR43-43-33CB/A01-ND

Manufacturer Part#:

APR43-43-33CB/A01

Price: $ 5.85
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR43-43-33CB/A01 datasheetAPR43-43-33CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 5.26938
Stock 1000Can Ship Immediately
$ 5.85
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 1.657" (42.10mm)
Width: 1.657" (42.10mm)
Diameter: --
Height Off Base (Height of Fin): 1.283" (32.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 1.48°C/W @ 200 LFM
Thermal Resistance @ Natural: 6.41°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The APR43-43-33CB/A01 application field is in the thermal field and the heat sinks. As its name implies, a thermal heat sink is a device that dissipates heat away from a semiconductor element, such as a transistor or IC. Such a device is used in radios, televisions, computers, and other electronic devices.

Basically, a heat sink is a type of device that facilitates the transfer of heat from an electronic device into the environment. Heat sinks come in a variety of designs, such as flat plates, fins, pipes, and even blocks of metal. However, the basic principle remains the same: a heat sink is designed to absorb heat and disperse it away from the electronic device.

The APR43-43-33CB/A01 is a type of flat plate heat sink. It has a compact design that is highly efficient in transferring heat away from the semiconductor element. This heat sink is made of aluminum alloy and is highly resistant to oxidation. The design is also highly effective at reducing thermal resistance, which is a measure of how easily heat can move from the device to the environment. Thus, when the APR43-43-33CB/A01 is used, the device will be able to keep temperatures at a safe level.

The working principle of the APR43-43-33CB/A01 is simple. It operates by dissipating the heat generated by the semiconductor element through the heat sink. This is done through conduction, the transfer of heat between two objects. Heat generated by the semiconductor element is conducted through the metal heat sink, which dissipates it into the air. The heat is dissipated in all directions - away from the semiconductor element and into the environment.

The APR43-43-33CB/A01 is highly effective at dissipating heat and reducing temperatures. This is due to its highly efficient design and use of high-quality materials. Additionally, it can be easily installed and is relatively inexpensive compared to other types of heat sinks. Thus, it is an ideal heat sink for many semiconductor applications.

Overall, the APR43-43-33CB/A01 is a highly efficient thermal heat sink. It dissipates heat quickly and efficiently, while also keeping costs low. This makes it an ideal choice for many applications, especially those that need reliable temperature control and high efficiency.

The specific data is subject to PDF, and the above content is for reference

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