APR48-48-21CB/A01

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Introduction

The APR48-48-21CB/A01 is a thermal solution component for electronic applications. It acts as a heat sink to dissipate the generated heat from the electronic device, ensuring no damage from thermal runaway, and enhancing system stability and longevity. Its design is based on the principles of forced convection heat transfer and it is compatible with a broad range of surface mount devices.

Application Field

The APR48-48-21CB/A01 is suitable for a variety of applications including the ones mentioned below:

• Field Programmable Gate Array (FPGA)
• Digital Signal Processors (DSP)
• Application Specific Integrated Circuit (ASIC)
• Clock oscillators
• Computing systems
• High current IC\'s
• Lighting systems
• Power electronics

Working Principle

The working principle of the APR48-48-21CB/A01 is based on Forced Convection Heat Transfer. In this method, the heat generated by the electronic device is transferred to the air by means of a heat conducting element such as metal fins. The metal fins act as a heat sink, absorbing the heat and transferring it to the surrounding air through the metal fins. This process is enhanced by increasing the surface area of the metal fins, increasing the air flow and by using natural or forced convective cooling. The air flow should be considered while designing the system as the air flow should not be restricted by two closeby components.

The heat sink should be able to dissipate enough heat in order to fulfill the needs of the electronic device. This requires the heat sink to have a specific thermal resistance and the total heat generation should not exceed the maximum rated temperature of the heat sink. For this, the air flow should be sufficient and as uniform as possible to ensure the desired heating distribution.

The APR48-48-21CB/A01 heat sink is designed to dissipate a maximum power of 2W, has a thermal resistance of 1.2°C/W and a maximum temperature of 150°C. It is compatible with a range of surface mount devices and is available in two sizes, 48-48-21CB and 48-48-21AB. As a thermal solution component, it offers an economical and reliable way to meet the thermal needs of a wide range of electronic devices.

Conclusion

The APR48-48-21CB/A01 is an economical and reliable thermal solution component for electronic applications. It is based on the principles of Forced Convection Heat Transfer and offers a maximum power dissipation of 2W. It has a thermal resistance of 1.2°C/W and a maximum temperature of 150°C. It is suitable for applications such as FPGA, DSP, ASIC, clock oscillators, computing systems, high current IC\'s, lighting systems and power electronics, and is available in two sizes.

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