Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The APR45-45-33CB/A01 thermal Heat Sink is a type of passive heat exchanger that transfers the heat generated by an electronic or mechanical device into a fluid medium, often air or a liquid coolant. Heat sinks are used in a variety of applications to cool circuits and components such as microprocessors, dense servers, LEDs, and power transistors. The APR45-45-33CB/A01 is an extruded aluminum heat sink for heat dispersion with the ability to dissipate up to 40 Watts of waste heat.

Working Principle of APR45-45-33CB/A01 Thermal-Heat Sink

The working principle of a thermal-heat sink is to use the thermal properties of materials to transfer heat away from the component or system being cooled. In most applications, air is the fluid medium used in heat transfer. Heat sinks employ an array of fins connected to a base designed to promote increased surface area. The base is usually a metal with high thermal conductivity, such as aluminum or copper, while the fins are made of aluminum, copper, or steel sheets.

The working principle of the APR45-45-33CB/A01 heat sink is based on natural convection. Cold air enters the area around the heat sink, which is then heated by the components mounted on the heat sink. The heated air then flows out, taking the heat from the component with it. This cycle is repeated until the components have cooled to the ambient temperature.

The APR45-45-33CB/A01 has an extruded aluminum fin design that provides maximum heat transfer. The fins are arranged in a “staggered” pattern to create more pathways for convective air flow. The external fins are also designed to reduce turbulence and maximize air flow, resulting in improved cooling performance. The heat sink also has a high-temperature anodized aluminum fin surface, which increases its thermal conductivity even further.

Application Fields of APR45-45-33CB/A01 Thermal-Heat Sink

The APR45-45-33CB/A01 Thermal-Heat Sink is an ideal solution for cooling various electronic components and systems. It is designed to dissipate heat in an efficient, reliable, and cost-effective manner. Some of its applications include:

• Boards with high-power components such as CPUs, GPUs, and DDR memory
• Industrial automation applications
• Medical instruments
• Computers and computer peripherals
• Networking equipment
• Power electronics

The APR45-45-33CB/A01 also offers user-friendly features such as easy installation, flexible mounting options, and superior thermal performance. It is lightweight and comes in a variety of sizes, making it an ideal choice for both small-scale and large-scale applications. Finally, this premium heat sink is backed by a limited lifetime manufacturer’s warranty.

Conclusion

The APR45-45-33CB/A01 Thermal-Heat Sink is designed to dissipate up to 40 Watts of waste heat. It is an ideal solution for cooling various types of electronic components and systems, including boards with high-power components, industrial automation applications, medical instruments, networking equipment, and power electronics. The APR45-45-33CB/A01 offers excellent thermal performance and user-friendly features such as easy installation and flexible mounting options. It is backed by a limited lifetime manufacturer’s warranty.

The specific data is subject to PDF, and the above content is for reference