APR48-48-28CB/A01 Allicdata Electronics
Allicdata Part #:

APR48-48-28CB/A01-ND

Manufacturer Part#:

APR48-48-28CB/A01

Price: $ 7.83
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR48-48-28CB/A01 datasheetAPR48-48-28CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 7.04991
Stock 1000Can Ship Immediately
$ 7.83
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 1.854" (47.10mm)
Width: 1.854" (47.10mm)
Diameter: --
Height Off Base (Height of Fin): 1.087" (27.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 1.79°C/W @ 200 LFM
Thermal Resistance @ Natural: 6.42°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are an increasingly popular choice when in need of heat dissipation components for electronics and other heat generating components. The APR48-48-28CB/A01 is a case-mount aluminum heat sink designed to maximize both thermal performance and space utilization. This heat sink can dissipate up to 4.1W of power with an overall profile of about 3.44 inches wide (including one side) from corner to corner.

The APR48-48-28CB/A01 offers many advantages for applications where thermal performance and space utilization are paramount. The aluminum construction of this heat sink provides uniform thermal performance across a wider temperature range than other materials such as plastic or silicone. The larger size of this heat sink allows for an increased surface area, reducing hot spots which often plague smaller, cheaper heat sinks.

The heatsink uses either a thermal pad or thermal grease to form a “sandwich interface” between the heatsink and the component to be cooled. This helps to increase the amount of heat that can be dissipated at one time. Additionally, the thermal pad helps to create an airtight seal between the heatsink and the component which helps to further increase the amount of heat that can be dissipated.

The basis of thermal management for the APR48-48-28CB/A01 comes from its copper base which is is strategically designed to reduce thermal resistance by providing increased surface area. The combination of the high surface area of the base and the fin profile of the heatsink provides the thermal resistance that is necessary to dissipate heat effectively.

The fins on the heatsink are an important component to its cooling effectiveness. These fins are designed to create an effective air flow around the heatsink which helps to increase cooling performance. This air flow, combined with the thermal pad, helps to move the heat away from the component and into the atmosphere.

The APR48-48-28CB/A01 heat sink is suited for applications that require thermal management of heat generating components. Such applications include powering up electronic billboards, LED lighting, automotive diagnostic equipment and home entertainment systems. It is also used in server racks, computers, gaming systems and set top boxes. The thermal performance, space utilization, and cost savings associated with this heat sink make it an ideal choice for many applications.

In conclusion, the APR48-48-28CB/A01 heat sink offers an effective and efficient way to manage the heat generated by various types of components. Its combination of thermal performance, space utilization, and cost savings make it a popular choice for many applications. Its aluminum construction and fin design make it highly effective at dissipating heat, and the thermal pad helps to create an airtight seal to further reduce thermal resistance. The APR48-48-28CB/A01 is an ideal choice when thermal management is a must.

The specific data is subject to PDF, and the above content is for reference

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