| Allicdata Part #: | FMG2G400US60-ND |
| Manufacturer Part#: |
FMG2G400US60 |
| Price: | $ 0.00 |
| Product Category: | Discrete Semiconductor Products |
| Manufacturer: | ON Semiconductor |
| Short Description: | IGBT MOLDING 600V 400A 7PM-IA |
| More Detail: | IGBT Module Half Bridge 600V 400A 1136W Chassis M... |
| DataSheet: |  FMG2G400US60 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | 0.00000 |
| Series: | -- |
| Part Status: | Obsolete |
| IGBT Type: | -- |
| Configuration: | Half Bridge |
| Voltage - Collector Emitter Breakdown (Max): | 600V |
| Current - Collector (Ic) (Max): | 400A |
| Power - Max: | 1136W |
| Vce(on) (Max) @ Vge, Ic: | 2.7V @ 15V, 400A |
| Current - Collector Cutoff (Max): | 250µA |
| Input: | Standard |
| NTC Thermistor: | No |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| Mounting Type: | Chassis Mount |
| Package / Case: | 7PM-IA |
| Supplier Device Package: | 7PM-IA |
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TheFMG2G400US60isacosteffective,highpowerIGBTmodulesolutiondesignedforthehighfrequencyinvertermarket.Itissuitableformanytypeofhighpowerapplication,frommotorcontroltoindustrialinverters.ThisIGBTmoduleisofferedbyeuropeanmanufacturerInfineonandfeatureshigh-densityIGBTswithalowprofilepackage.
TheFMG2G400US60iscomposedofaMOSFETgatechopper,twoIGBTswithParallelEmitterConfiguration(PEC)withenhancedCurrentCollectors,powderspacers,thermaldesignmaterialsandsomeotherdevices.
TheworkingprincipleoftheFMG2G400US60beginswiththeMOSFETgatechopper,whichisoperatedbyapplyingaDCvoltagetothegate.Theswitchisclosedwhenagateto-drainvoltagedifferencereachesaprederminedvalueanditactsasaswitchtoconnectorisconnectortodrain.
Then,thisswitchingvoltagewillbeusedtoactuatetwoIGBTswithParallelEmitterConfiguration(PEC).TheswitchingoftheseIGBTswillbedrivenbythegatevoltageoftheMOSFET.Whenigateto-drainvoltagedifferencereachesapredeterminedvalue,thetwoeigbtswillturnonsimultaneously.
ThePECconfigurationallowsIGBTstoseeparatelyconductcurrentsthroughtheirrespectiveemitters.ThisallowsbothIGBTstooperateatmaximumefficiencyandutilizetheirentirecurrentrange.
ThepowderspacersareusedtoreducethermalresistancebetweenthetopandbottomIGBTpackagesastheyaccumulatesomeoftheradiantheatgeneratedbytheIGBTs.
ThethermaldesignmaterialsusedintheFMG2G400US60havedesigndimensionssuchascoolingfinheightandwidththatareoptimizedtodelivermaximumthermalperformancenecessaryfordemandinghighpowerapplications.
Inconclusion,theFMG2G400US60isahighpowerIGBTmodulesolutionthatisideallysuitedforthosehighfrequencyinvertermarkets.Itisacosteffectivemodulesolutionthathasbeenoptimizedtodeliveroptimumperformanceforanyhighpowerapplication.TheMOSFETgatechoppingfunction,ParallelEmitterConfiguration(PEC),powderspacersandthermaldesignmaterialsareallstrategicallypartofthismodulesolutiontodeliverthebestinclassperformance.
The specific data is subject to PDF, and the above content is for reference
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