Allicdata Part #: | FS20R06XE3BOMA1-ND |
Manufacturer Part#: |
FS20R06XE3BOMA1 |
Price: | $ 25.91 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | Infineon Technologies |
Short Description: | MOD IGBT LOW PWR EASY1-1 |
More Detail: | IGBT Module |
DataSheet: | FS20R06XE3BOMA1 Datasheet/PDF |
Quantity: | 1000 |
20 +: | $ 23.55660 |
Series: | * |
Part Status: | Not For New Designs |
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The FS20R06XE3BOMA1 module is a type of insulated gate bipolar transistor (IGBT) module used in various applications. An IGBT module is what allows the connection between a high-voltage power source, such as a power plant, to a low-voltage circuit connected to various electrical equipment. This allows for a level of efficiency and performance that wouldn\'t be possible with a conventional system of power transmission. The FS20R06XE3BOMA1 module is designed for applications such as electric power conversion, automotive, UPS systems, power management, industrial motor drives, renewable energy, and so on.
An insulated gate bipolar transistor (IGBT) is a three-terminal voltage-controlled semiconductor switch and a component of the modern power electronics revolution. The IGBT combines the advantages of the two earlier power devices, the field-effect transistor (FET) and the bipolar transistor (BJT). This combination of two different switching elements gives the IGBT superior performance when compared to either of its predecessors. With its high current density, high frequency operation, low losses, and low noise, IGBTs are highly suitable for many power management applications.
The FS20R06XE3BOMA1 module utilizes a single IGBT component made of 200mm long-lasting, reliable silicon. This module is rated for an operating voltage of 200V to 1200V and a maximum current of 40A. It also comes with a low collector to emitter saturation voltage of less than 3.5V, making it ideal for applications where high-speed switching is needed. This module also has an integrated temperature sensor, a pilot release circuit, and an insulation test function to provide reliable protection.
The FS20R06XE3BOMA1 module has a baseplate made of aluminum with good thermal conductivity for heat dissipation. This module also has an embedded high-density ceramic substrate for enhanced performance and reliability. Its housing is made of reinforced epoxy resin which is highly resistant to high temperature and electric corrosion. Together, these features make the module suitable for a wide range of high voltage and power applications.
In terms of its working principle, the FS20R06XE3BOMA1 module works via the following process. A power source is connected to the positive and negative sides of the module, while the switching circuit between the two is activated when a voltage or current is sent to the control pins. This activates the gate of the IGBT, allowing current to flow between the collector and emitter of the transistor. When the voltage or current is no longer sent, the IGBT is disabled, so that no current is allowed to flow between the two terminals.
The FS20R06XE3BOMA1 module is an ideal choice for various applications, due to its high current density, low losses, and low noise. With its robust design and reliable performance, this module can be used in a variety of applications such as electric power conversion, automotive, UPS systems, power management, industrial motor drives, and renewable energy. This IGBT module is highly suitable for many power management applications, due to its high current density, high frequency operation, low losses and low noise.
The specific data is subject to PDF, and the above content is for reference
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