| Allicdata Part #: | FSLP636-ND |
| Manufacturer Part#: |
FSLP636 |
| Price: | $ 8.68 |
| Product Category: | Uncategorized |
| Manufacturer: | Panduit Corp |
| Short Description: | 36-FIBER OM1 MULTIMODE OFNP (PLE |
| More Detail: | N/A |
| DataSheet: | FSLP636 Datasheet/PDF |
| Quantity: | 1000 |
| 3281 +: | $ 7.89663 |
| Series: | * |
| Part Status: | Active |
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FSLP636 application field and working principle is an interesting topic to discuss. FSLP636 is a high-performance, precision, low-temperature, low-power lithography system. It has been developed and produced specifically for the stringent requirements of advanced research and development projects in the semiconductor industry.
The FSLP636 can work at temperatures as low as -60°C, making it able to function in a wide range of applications. This is especially useful for working with solders, as they will not become brittle and break if exposed to extreme temperatures. It is also suitable for the production of integrated circuits and printed circuit boards.
The FSLP636 uses a laser beam and magnetic focusing system to separate thin layers of material from a substrate. This is accomplished via two processes: exposing and focusing. The laser exposes the specific layer that needs to be exposed, while the magnetic focusing system moves the beam over the substrate for the exposure process. After the exposure process is complete, the layers are separated off of the substrate, forming an integrated device.
The FSLP636 is designed with a maximum degree of accuracy and precision, offering extremely fine spatial resolution. This makes it ideal for a variety of applications, including the production of very thin layers of material, such as photoresist, which is used for device processes such as patterning, doping, and etching.
The FSLP636 is also extremely reliable, and can produce extremely high repeatability and reproducibility. This is extremely important for the production of devices and components that must have the highest level of accuracy and precision.
The FSLP636 can also be used for the production of flip chip and bead-on-chip packages. This allows for the integration of multiple chips on a single package, reducing the number of packages necessary for a single circuit. This makes the FSLP636 an attractive option for many circuit designers.
The FSLP636 is a highly advanced lithography system, which can provide many advantages to researchers and manufacturers. It is capable of producing extremely precise and accurate results, while also providing the reliability and repeatability necessary for mass production. This makes it suitable for a variety of applications, making it an excellent choice for the production of advanced devices.
The specific data is subject to PDF, and the above content is for reference
| Part Number | Manufacturer | Price | Quantity | Description |
|---|
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| FSLP972 | Panduit Corp | 10.05 $ | 1000 | 72-FIBER OS2 SINGLEMODE O... |
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| FSLP608 | Panduit Corp | 2.71 $ | 1000 | 8-FIBER OM1 MULTIMODE OFN... |
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| FSLP572 | Panduit Corp | 11.81 $ | 1000 | 72-FIBER OM2 MULTIMODE OF... |
| FSLP912 | Panduit Corp | 2.43 $ | 1000 | 12-FIBER OS2 SINGLEMODE O... |
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| FSLP636 | Panduit Corp | 8.68 $ | 1000 | 36-FIBER OM1 MULTIMODE OF... |
| FSLP512 | Panduit Corp | 2.74 $ | 1000 | 12-FIBER OM2 MULTIMODE OF... |
| FSLP696 | Panduit Corp | 16.71 $ | 1000 | 96-FIBER OM1 MULTIMODE OF... |
| FSLP908 | Panduit Corp | 2.39 $ | 1000 | 8-FIBER OS2 SINGLEMODE OF... |
| FSLP604 | Panduit Corp | 2.23 $ | 1000 | 4-FIBER OM1 MULTIMODE OFN... |
| FSLP548 | Panduit Corp | 9.42 $ | 1000 | 48-FIBER OM2 MULTIMODE OF... |
| FSLP924 | Panduit Corp | 2.92 $ | 1000 | 24-FIBER OS2 SINGLEMODE O... |
| FSLP672 | Panduit Corp | 12.8 $ | 1000 | 72-FIBER OM1 MULTIMODE OF... |
| FSLP948 | Panduit Corp | 8.23 $ | 1000 | 48-FIBER OS2 SINGLEMODE O... |
| FSLP996 | Panduit Corp | 13.07 $ | 1000 | 96-FIBER OS2 SINGLEMODE O... |
DIODE GENERAL PURPOSE TO220
CB 6C 6#16 SKT RECP
CA08COME36-3PB-44
CA-BAYONET
CB 6C 6#16S SKT PLUG
CAC 3C 3#16S SKT RECP LINE
FSLP636 Datasheet/PDF