Allicdata Part #: | MAX31730AUB+T-ND |
Manufacturer Part#: |
MAX31730AUB+T |
Price: | $ 0.55 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Maxim Integrated |
Short Description: | IC REMOTE TEMP SENSOR USSOP |
More Detail: | ASIC, CPU, FPGA Die Temp Monitoring Interface 10-u... |
DataSheet: | MAX31730AUB+T Datasheet/PDF |
Quantity: | 1000 |
2500 +: | $ 0.50585 |
Series: | -- |
Packaging: | Tape & Reel (TR) |
Part Status: | Active |
Applications: | ASIC, CPU, FPGA Die Temp Monitoring |
Interface: | 2-Wire |
Voltage - Supply: | 3 V ~ 3.6 V |
Package / Case: | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Supplier Device Package: | 10-uMAX |
Mounting Type: | Surface Mount |
Base Part Number: | MAX31730 |
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The MAX31730AUB+T is a specialized interface that is used in various commercial and industrial applications. This interface is designed to provide low power, robust performance and low cost, allowing applications such as automation, industrial control, industrial printing, instrumentation, medical and military applications to operate at optimal levels. In this article we will discuss the application field and working principle of the MAX31730AUB+T.
The MAX31730AUB+T is an ASIC (Application-Specific Integrated Circuit) that is designed to provide low power, robust performance for a variety of applications. The MAX31730AUB+T has been designed for ease of use with various communication interface protocols such as SPI, I2C, UART and CAN bus. It also has integrated memory and programmable logic to provide flexibility when setting up various communication protocols.
The MAX31730AUB+T can be implemented in a variety of different applications. Automation applications can benefit from the MAX31730AUB+T\'s low-power architecture, robust performance and low cost. The MAX31730AUB+T can be used in industrial control systems to provide control over production processes. The MAX31730AUB+T can also be used in industrial printing applications to control the printing process. Additionally, the MAX31730AUB+T can be used in instrumentation, medical and military applications to provide reliable operation in highly variable environments.
The MAX31730AUB+T is a low power device and has been designed to operate in temperatures ranging from -40 to +125°C. It has an integrated oscillator which provides the clock signal necessary for the device to operate. The device also has a power management system which can dynamically adjust the power consumption depending on the application.
The working principle of the MAX31730AUB+T is based on the I2C and SPI communication protocols. I2C is used for communication between the MAX31730AUB+T and other components of the system. This communication protocol allows for communication between multiple devices and the MAX31730AUB+T simultaneously. The SPI protocol is used for communication with the other components of the system. This protocol is used for configuring the various parameters of the MAX31730AUB+T.
The MAX31730AUB+T is capable of operating at incredibly low power due to its robust high-performance design. The power consumption of the MAX31730AUB+T ranges from 0.64mA at 3.3V to 3mA at 12V. This power consumption is much lower than most other industrial interface devices and can provide extended operational life for applications in high-vibration or extreme-temperature environments.
In addition to its low power consumption, the MAX31730AUB+T also offers excellent EMI/RFI immunity. The device has been designed to reject high-frequency noise up to 4 GHz, which makes it ideal for applications in noisy environments. The device also has built-in protection against overvoltage and reverse polarity to ensure reliable operation.
The MAX31730AUB+T is a specialized interface that can be used in a variety of industrial and commercial applications. The device is designed with low power, robust performance, low cost, and excellent EMI/RFI immunity, allowing applications in industrial printing, control, instrumentation, medical and military applications to operate at optimal levels.
The specific data is subject to PDF, and the above content is for reference
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