MCF5275CVM133 Allicdata Electronics
Allicdata Part #:

MCF5275CVM133-ND

Manufacturer Part#:

MCF5275CVM133

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: NXP USA Inc
Short Description: IC MCU 32BIT ROMLESS 256MAPBGA
More Detail: Coldfire V2 MCF527x Microcontroller IC 32-Bit 133M...
DataSheet: MCF5275CVM133 datasheetMCF5275CVM133 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Program Memory Type: ROMless
Base Part Number: MCF5275
Supplier Device Package: 256-MAPBGA
Package / Case: 256-LBGA
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Data Converters: --
Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
RAM Size: 64K x 8
EEPROM Size: --
Series: MCF527x
Program Memory Size: --
Number of I/O: 69
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Speed: 133MHz
Core Size: 32-Bit
Core Processor: Coldfire V2
Part Status: Obsolete
Packaging: Tray 
Description

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MCF5275CVM133 application field and working principle

The MCF5275CVM133 is a family of low-cost, low-power embedded 32-bit processors based on the Motorola Coldfire architecture. The MCF5275CVM133 is designed to meet the needs of embedded applications requiring a cost-effective product with dedicated low-power features, leading industry standard peripheral support and a wide range of development tools.

The MCF5275CVM133 are designed to provide embedded design engineers with the performance, flexibility, reliability, and scalability expected from leading 32-bit microprocessor solutions. The MCF5275CVM133 is supported by a broad family of associated development tools including integrated development environment, emulation, and evaluation boards, software stacks and many third party tools.

Application Field:

The MCF5275CVM133 is well suited for a wide variety of embedded applications such as network infrastructure, medical, industrial automation, automotive, and consumer applications. With its high-performance communications, powerful peripherals and low power operation, the MCF5275CVM133 can be used to quickly bring reliable, robust, efficient, and cost-effective systems to market.

The MCF5275CVM133 is an ideal choice for a full range of embedded applications requiring embedded processors with low-power operation, high performance communications, on-chip peripherals, and a large variety of external peripherals. The MCF5275CVM133 is especially well-suited for applications that require battery and line powered devices, such as wristwatches, point-of-sale terminals, and battery operated communication devices.

Working Principle:

The MCF5275CVM133, also known as the MCF5275CVM1.33K), is based on the Coldfire Reduced Instruction Set Computer (RISC) architecture and is optimized for low-power embedded applications. Designed for ultra-low-power operation, the MCF5275CVM133 incorporates several proprietary low-power features including Clock Throttling, Dynamic Power Management, and Dynamic Clock Gating. These features, along with the advanced power management features of the MCF5275CVM133, allow the processor to provide very low power system operation.

The MCF5275CVM133 features a 32-bit Coldfire RISC core running at 133MHz with 32KB of on-chip SRAM, 16KB of instruction cache, 8KB of data cache, and 32KB of static PROM (boot ROM). In addition, the MCF5275CVM133 includes an on-chip 10/100 Ethernet controller, Serial Communication Controller (SCC), three UARTs, an eight channel DMA controller, four timer channels, and two watchdog timer channels.

The MCF5275CVM133 also features four digital signal processor (DSP) cores which can be used for signal processing operations. This enables the MCF5275CVM133 to perform real-time signal processing functions such as real-time systems, communication protocol decode/encode, graphics functions, image processing, and data compression/decompression.

Overall, the MCF5275CVM133 is an ideal solution for embedded systems requiring highest performance, lowest power, and high peripheral integration. The MCF5275CVM133 delivers the performance and expandability necessary for high performance embedded applications coupled with low power consumption designed to enable maximum battery life for applications operating in battery-based environments.

The specific data is subject to PDF, and the above content is for reference

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