MT53D4DANW-DC TR Allicdata Electronics
Allicdata Part #:

MT53D4DANW-DCTR-ND

Manufacturer Part#:

MT53D4DANW-DC TR

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Micron Technology Inc.
Short Description: SPECIAL/CUSTOM LPDDR4
More Detail: Memory IC
DataSheet: MT53D4DANW-DC TR datasheetMT53D4DANW-DC TR Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: *
Packaging: Tape & Reel (TR) 
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Memory technology is advancing at an ever-increasing rate, and new inventions in this domain are making life easier and data access faster. MT53D4DANW-DC TR is the latest invention in memory technology and offers an efficient solution for data storage, access, and retrieval. It is specially designed to meet the growing needs of cloud storage and internet of things. This article will provide an overview of its application field and working principle.

MT53D4DANW-DC TR is a type of non-volatile memory (NVM) that offers high speed with low latency. It is based on 3D NAND technology, which provides faster and more reliable storage than traditional NAND. This type of memory is ideal for applications that require quick data access and retrieval, such as mobile devices and cloud storage solutions. It is also used in automotive and industrial applications due to its high reliability and robustness.

One of the unique features of MT53D4DANW-DC TR is that it is also a type of Intel Optane Memory. This allows for faster data access and retrieval, which is especially useful for applications that need to access large amounts of data. The combination of 3D NAND and Intel Optane Memory provides a much faster and efficient storage solution than traditional memory technologies.

The working principle of MT53D4DANW-DC TR is based on three main components: the Flash over chip (FOC), the Flash over Network-Packet (FONP) and the Link Aggregation Protocol (LAP). The FOC is responsible for controlling the flow of data between the memory and the processor. It uses the FONP and LAP protocols, which allow the memory to access data quickly and efficiently. The flash over chip also helps in optimizing the power consumption of the device, as it can reduce the power requirement of the device.

The FONP protocol is a layer-2 routing protocol that is used to route data to and from MT53D4DANW-DC TR. The LAP protocol allows for aggregation of packets, which helps to provide a more efficient data transfer rate. Both protocols are optimized for high speed, low latency and efficient power consumption.

Finally, MT53D4DANW-DC TR is also a type of memory that has been optimized for low power consumption. This makes it an ideal choice for applications that require high speed, low latency and efficient power consumption. It is particularly suitable for applications that require data access and retrieval on a large scale or in environments that are difficult to maintain or prone to interference.

In conclusion, MT53D4DANW-DC TR is a highly efficient memory solution that offers high speed, low latency and power efficiency. It is ideal for applications that require quick access and retrieval of data and is particularly suitable for cloud storage and internet of things. The memory is based on 3D NAND technology, Intel Optane Memory and FONP, and LAP protocols, which all provide an efficient, reliable and robust storage solution.

The specific data is subject to PDF, and the above content is for reference

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