PH3N-100-100-0.07-1A

Series:	PH3n
Part Status:	Active
Type:	Heat Spreader
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Adhesive
Shape:	Square
Length:	3.937" (100.00mm)
Width:	3.937" (100.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.003" (0.07mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Copper
Material Finish:	Polyester

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.Thermal - Heat Sinks: PH3N-100-100-0.07-1A Application Field and Working PrincipleHeat sinks are important components within a wide range of thermal management solutions and can be integrated into existing systems to increase heat sinking capabilities. Heat sinks perform the vital function of actively dispersing heat away from sensitive electrical components and ensuring their safe operation. One such heat sink is the PH3N-100-100-0.07-1A, which is designed specifically for reliable high-power applications in industrial and military environments.This article will explore the application field of the PH3N-100-100-0.07-1A as well as its working principle. It is hoped that the resulting insights will better equip readers with the knowledge necessary to identify and integrate the right heat sink solutions for optimal thermal management in their own systems.Heat-sinking ApplicationsThe PH3N-100-100-0.07-1A is a natural choice for high-power application where capacities of up to 2000W are required. Its design is inherently ideal for thermal management in mission-critical applications such as aerospace, defense, or medical systems, which require optimal cooling solutions that guarantee safe and reliable operation.This heat sink’s extremely wide thermal range also makes it suitable for a variety of other applications. These include industrial and automotive applications, as well as in the telecommunications and consumer electronics sectors. This versatility provides users with a wealth of practical uses in a range of environments.Working PrincipleAt the heart of any thermal management solution lies the question of how heat can be effectively dissipated away from sensitive electronic components and subsystems. The PH3N-100-100-0.07-1A uses a simple and effective technology to do just that. The characteristics that enable it to provide efficient thermal management are its full aluminum slot design, automotive-grade plastic fan blades, and a unique indirect natural cooling cycle.The heat sink’s full aluminum slot design functions as a large heatsink, which is able to dissipate a high amount of thermal energy away from the substrate. The fan blades are precision-engineered to move the hot air out of the thermal cabinet quickly and efficiently, while the unique natural cooling cycle is designed to minimize thermal resistance and maximize heat transport capabilities.The combined effect of these technologies enables the PH3N-100-100-0.07-1A to achieve excellent thermal performance. This performance is further increased when used in conjunction with other thermal sources such as forced air cooling and liquid cooling.ConclusionThis article has explored the application field of the PH3N-100-100-0.07-1A heat sink along with its working principles. This heat sink is designed to provide reliable and high-performance thermal management in a range of mission-critical applications, as well as in the automotive, industrial, and telecommunications sector. Its full aluminum slot design, automotive-grade plastic fan blades, and unique natural cooling cycle all contribute to its excellent thermal performance. This article has equipped readers with the knowledge necessary to identify and integrate the right heat sink solutions for optimal thermal management for their own systems.

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