PH3N-101.6-38.1-0.062-1A

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Thermal - Heat Sinks

A thermal - heat sink is a device that uses thermal energy to absorb and dissipate heat from electrical components and semiconductor devices. The PH3N-101.6-38.1-0.062-1A Heat Sink is designed to mount directly to a circuit board and provide a cooling solution for a wide variety of applications. Its unique design and construction allows for wide compatibility with many types of semiconductor devices, offering superior thermal performance and reliability. In this article, we will delve into the application fields and working principles of the PH3N-101.6-38.1-0.062-1A Heat Sink.

Application Fields

The PH3N-101.6-38.1-0.062-1A Heat Sink is designed to be used for a variety of application fields, including:

• Desktop and server computers
• Electronic products
• Industrial cooling applications
• Medical equipment
• Telecommunication systems
• Semiconductor devices
• Inverter/converter systems
• Battery systems
• Solar energy systems

The PH3N-101.6-38.1-0.062-1A Heat Sink is designed to be installed directly on to the circuit board, either by standoffs, screws, or tape.

Working Principle

The PH3N-101.6-38.1-0.062-1A Heat Sink works by using the principle of thermal energy transfer. If a semiconductor device generates heat, the heat has to be dissipated away from the device in order to avoid malfunction. The heat sink takes the heat and dissipates it away from the semiconductor device through a combination of conduction and convection. The heat sink is designed to provide superior performance and reliability in a range of different applications.

The heat sink has a unique design which allows it to be used with a variety of semiconductor devices. It features a black anodized aluminum sheet, which is designed to draw the heat away from the semiconductor device. The heat is then dissipated away from the semiconductor device using a combination of thermal conduction and convection. The design of the PH3N-101.6-38.1-0.062-1A Heat Sink allows for greater flexibility and improved cooling performance.

Thermal Resistance

The PH3N-101.6-38.1-0.062-1A Heat Sink features a unique construction which helps to reduce the thermal resistance between the device and the heatsink. The thermal resistance is measured in degrees Celsius-per-Watt (°C/W), and it is an important factor in determining the performance of any semiconductor device. The PH3N-101.6-38.1-0.062-1A Heat Sink is designed to have a thermal resistance of 0.062°C/W, which is significantly lower than other similar products on the market and makes it suitable for a wide range of applications.

Conclusion

The PH3N-101.6-38.1-0.062-1A Heat Sink is designed to provide superior performance and reliability for a wide range of applications. It features a black anodized aluminum sheet, which is designed to draw the heat away from the semiconductor device, while its unique construction helps to reduce the thermal resistance. It is suitable for a number of applications, including desktop and server computers, electronic products, industrial applications, medical equipment, and solar energy systems. With its superior performance and reliability, the PH3N-101.6-38.1-0.062-1A Heat Sink is an excellent choice for any application requiring thermal control.

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