Series:	PH3n
Part Status:	Active
Type:	Heat Spreader
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Adhesive
Shape:	Rectangular
Length:	4.000" (101.60mm)
Width:	1.000" (25.40mm)
Diameter:	--
Height Off Base (Height of Fin):	0.002" (0.06mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Copper
Material Finish:	Polyester

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Introduction

Thermal or heat sinks have been used within electronic systems for decades. They are designed to draw away heat from existing components within the system, providing cooling that can help to deliver improved long-term performance and longevity. The PH3N-101.6-25.4-0.062-1A is a thermal/heat sink specifically designed to cool components in the electronic systems. In this article we will look at the application of this particular unit and the fundamental working principles that allow it to function.

Application

The PH3N-101.6-25.4-0.062-1A thermal/heat sink is designed for use within all types of electronic systems. It is particularly suitable for use in high-performance applications. The unit is an extremely high-performance device and offers superior cooling. It can be used in many applications including: power supplies, power stages, power modules, power transistors and other components that require a large amount of cooling. Its light weight, low-profile design makes it ideal for use in confined spaces.

Working Principle

The PH3N-101.6-25.4-0.062-1A thermal/heat sink helps to extract heat from the components and dissipate the energy outside the system. It consists of a single-piece aluminum base plate which is covered with cooling fins. The base plate is attached to the heat-generating components with screws. The base plate is connected to the cooling fins via a set of aluminum strips or rods. Heat is conducted away from the base plate and transferred to the cooling fins. The cooling fins absorb the heat energy and dissipate it out into the environment. The PH3N-101.6-25.4-0.062-1A thermal/heat sink also has a unique air flow system which helps to further increase cooling efficiency. The cooling fins are arranged in a special pattern which allows air to circulate freely around them. This helps to ensure that the cooling fins are constantly exposed to fresh air, which enhances the transfer of heat energy from the base plate to the fins. The air flow system also helps to reduce the noise generated by the unit.

Conclusion

The PH3N-101.6-25.4-0.062-1A thermal/heat sink is a highly efficient cooling device which is ideal for use in high-performance electronic systems. Its lightweight design, high-performance cooling and advanced air flow system make it a great choice for engineers who require reliable and efficient cooling of their components. With its advanced design features and excellent performance, the PH3N-101.6-25.4-0.062-1A is an excellent choice for any system.

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