PH3N-76.2-19.1-0.062-1A

Series:	PH3n
Part Status:	Active
Type:	Heat Spreader
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Adhesive
Shape:	Rectangular
Length:	3.000" (76.20mm)
Width:	0.750" (19.05mm)
Diameter:	--
Height Off Base (Height of Fin):	0.002" (0.06mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Copper
Material Finish:	Polyester

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Thermal - Heat Sinks

Heat sinks are important components used to regulate the temperature of equipment and components and prevent them from overheating. They dissipate the heat that may otherwise build up in the circuit, ensuring that the device remains within its ideal operating temperature. The PH3N-76.2-19.1-0.062-1A thermal-heat sink is one such sink used to transfer thermal energy away from an object.

How PH3N-76.2-19.1-0.062-1A Thermal-Heat Sinks Work

PH3N-76.2-19.1-0.062-1A thermal-heat sinks work by taking advantage of the phenomenon of heat conduction, which involves transferring thermal energy from one object to another. The thermal-heat sink is made up of aluminum with curved aluminum fins, and is designed to transfer heat away from equipment and components by creating a stable temperature gradient. The thermal-heat sink utilizes the airflow created by a fan, which draws air towards the sink from the bottom and shoots it out the top. As the air passes through the fin, thermal energy is conducted away from the attached components and transferred to the cooler airflow. This helps to ensure that the components remain within a desirable operating temperature.

Application Field

The PH3N-76.2-19.1-0.062-1A thermal-heat sink is an ideal and necessary component for a variety of computing and electronic applications, including computer gaming systems, medical equipment, power management devices, telecommunications systems, spacecraft, artificial satellites, complex consumer electronics, and other high-end applications.The PH3N-76.2-19.1-0.062-1A thermal-heat sink is designed to regulate and manage the heat in equipment and components. It is designed to fit into smaller spaces, as well as mount multiple devices, making it an ideal choice for applications that require miniaturization. Furthermore, the sink is manufactured to safely dissipate thermal energy, which is necessary for reducing the risk of damage and overheating in electronic components.

Advantages of PH3N-76.2-19.1-0.062-1A Thermal-Heat Sinks

The PH3N-76.2-19.1-0.062-1A thermal-heat sink offers several benefits, including:

• Highly efficient heat dissipation, allowing for better temperature control
• Lightweight construction, allowing for easy and convenient mounting
• Ideal for miniaturization projects, as it fits into tight spaces and can be mounted in multiple locations
• No external power supply is required, as the conductive fin is able to manage thermal energy with a fan
• Quick heat dissipation, allowing for longer product life
• Cost-effectiveness, as the PH3N-76.2-19.1-0.062-1A sink is a reliable option for thermal regulation

Conclusion

The PH3N-76.2-19.1-0.062-1A thermal-heat sink is an effective and reliable option for dissipating thermal energy from electronics and components. It is lightweight and highly efficient, making it ideal for any application where thermal regulation is needed. Furthermore, it offers the added benefit of being cost effective, enabling users to benefit from the peace of mind that comes with a reliable product.

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