QB1005A40WYS3 Allicdata Electronics
Allicdata Part #:

QB1005A40WYS3-ND

Manufacturer Part#:

QB1005A40WYS3

Price: $ 2.52
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For
DataSheet: QB1005A40WYS3 datasheetQB1005A40WYS3 Datasheet/PDF
Quantity: 1000
25 +: $ 2.26800
Stock 1000Can Ship Immediately
$ 2.52
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are generally used to easily and efficiently dissipate the heat generated from electronic components, and the QB1005A40WYS3 in particular is a good example of this. It is a heat sink with a unique design that provides superior performance and superior cooling compared to traditional heat sinks.

The QB1005A40WYS3 heat sink consists of three main components: a high thermal conductivity aluminum base plate, a low thermal resistance transition plate, and a forced air heat sink with a protective thermal shield. These components are held together by pressure pins or screws. The plate’s design ensures an effective thermal boundary by mechanically separating the aluminum base and the forced air heat sink, minimizing the thermal impedance between them. The thermal resistance between the two components is further minimized by filling the gap between them with a thermal paste which ensures good thermal conduction.

The heat generated from components such as CPUs, GPUs, and FERPA power amplifiers is transferred to the aluminum base plate. Heat then moves through the transition plate and into the heat sink from the large area of direct contact between the plate and heat sink. The heat sink then dissipates the heat into the surrounding atmosphere, keeping the components cool. The design of the QB1005A40WYS3 heat sink also ensures that the heat is efficiently dissipated with minimum noise.

To optimize its cooling capabilities the QB1005A40WYS3 features a number of special features. It has a higher density fin array for enhanced cooling power, and symmetrical fins that evenly distribute the air flow for more uniform cooling. The fins are also balanced with gaps that allow more air to flow through them, increasing its cooling performance. It uses fan faadings which help to reduce noise caused by reducing the number of fan revolutions per minute which helps to conserve power.

The QB1005A40WYS3 heat sink is a highly effective cooling solution for any electronic components, and is perfect for applications that require long-term and efficient cooling. The superior performance and reliable cooling of this heat sink make it a great choice for high-performance applications such as gaming, overclocking, and graphic performance boosting.

The specific data is subject to PDF, and the above content is for reference

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