QB1005B40ESC7 Allicdata Electronics
Allicdata Part #:

QB1005B40ESC7-ND

Manufacturer Part#:

QB1005B40ESC7

Price: $ 3.85
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For
DataSheet: QB1005B40ESC7 datasheetQB1005B40ESC7 Datasheet/PDF
Quantity: 1000
100 +: $ 3.49650
Stock 1000Can Ship Immediately
$ 3.85
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are devices that absorb and dissipate heat created by an electronic component or piece of equipment. Heat sinks can be used in a variety of applications, from everyday personal devices such as laptops and cell phones to highly specialized applications such as aerospace or medical equipment. One popular type of heat sink is the QB1005B40ESC7.

QB1005B40ESC7 Application Field

The QB1005B40ESC7 heat sink is a two-piece fin-stacked device made from aluminum. It is designed for commercial and industrial applications in need of low to medium thermal performance, and has the capacity to dissipate heat from components of up to 110 watts of power. This makes the QB1005B40ESC7 especially useful for electrical components such as power controllers or high-power transistors. The QB1005B40ESC7 has been tested to operate at temperatures of up to 250 degrees Celsius, meaning it can withstand a wide variety of demanding conditions.

Working Principle of QB1005B40ESC7

The QB1005B40ESC7 is a two piece fin-stacked heat sink. This means that it uses multiple metal fins, arranged in a stacked fashion, to absorb heat from the components it is attached to. As heat is absorbed, air circulation around the fins helps to dissipate the heat away from the components and into the environment. The QB1005B40ESC7 is designed with a heat sink base of 16mm and 0.65mm fin walls, allowing for better thermal transfer. Additionally, a special thermal adhesive is applied to improve the heat absorption and dissipation capabilities of the device.

Additional Considerations

When installing QB1005B40ESC7 heat sinks, consideration should be taken to account for the physical size of the device, as well as the airflow it will need to work correctly. The QB1005B40ESC7 is quite large compared to some other models, and so may require more space in the installation environment. Additionally, the fins of the QB1005B40ESC7 are designed to maximize air flow through them, so it is important to ensure there is sufficient airflow available to successfully dissipate the heat away from the components.

Conclusion

The QB1005B40ESC7 heat sink is an effective device of low to medium thermal performance, designed for industrial and commercial applications. The device is made up of fin-stacked aluminum that is able to absorb and dissipate up to 110 watts of power from components. Installation of the QB1005B40ESC7 should take into consideration the physical size and the airflow requirements in order to ensure proper operation. With the right environment, the QB1005B40ESC7 can help to keep components cool and running smoothly.

The specific data is subject to PDF, and the above content is for reference

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