QB1020B40ESTD Allicdata Electronics
Allicdata Part #:

QB1020B40ESTD-ND

Manufacturer Part#:

QB1020B40ESTD

Price: $ 4.48
Product Category:

Fans, Thermal Management

Manufacturer: American Technical Ceramics
Short Description: THERMAL CONDUCTOR Q-BRIDGE
More Detail: Heat Director/Transfer For
DataSheet: QB1020B40ESTD datasheetQB1020B40ESTD Datasheet/PDF
Quantity: 1000
1000 +: $ 4.03137
Stock 1000Can Ship Immediately
$ 4.48
Specifications
Series: Q-Bridge
Part Status: Active
Accessory Type: Heat Director/Transfer
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The QB1020B40ESTD Heat Sink is an effective, efficient, and economical solution for thermal management. Designed to provide superior thermal dissipation in a small footprint, the QB1020B40ESTD is suitable for a wide range of applications. It is capable of operating at up to 1,000 Watts of dissipated power allowing for a wide range of uses in industrial, consumer, and electronic devices.

The QB1020B40ESTD’s application field mainly lies in applications requiring efficient thermal management. It is capable of dissipating a significant amount of power while contributing to a relatively small amount of the overall system size. It is suitable for applications such as: servers, high-end desktop computers, workstations, CPUs, and GPUs.

The working principle of the QB1020B40ESTD heat sink involves the transfer of thermal energy from an application to its environment. It is accomplished by transferring the heat generated from the application to a thermal conductor, a component that conducts energy from the components onto the heat sink’s outer surface. The thermal conductor is usually composed of a metal or other material with good conductive properties and high thermal capacity, such as copper or aluminium. It is connected to the heat sink and other metal components are attached to it to create an efficient transfer of the thermal energy.

The process of heat transfer is further enhanced by applying a special type of fin arrangement on the surface of the thermal conductor. The fin arrangement consists of a series of fins, which act as a medium of heat transfer, allowing air to circulate around the fins. This helps to dissipate the heat from the components onto the fins. In addition to the fins, a fan can be mounted to the heat sink to help accelerate the process of cooling down the components.

There are also various materials that can be used to construct the heat sink, such as aluminum, copper, and steel. These materials each possess different conductive properties, which affect the efficiency of the thermal transfer and the rate of heat dissipation. Generally speaking, aluminum is more effective than copper or steel for dissipating thermal energy, but offers less strength. This tradeoff can make aluminum the ideal material for some applications.

The QB1020B40ESTD Heat Sink utilizes a combination of outlined technology and features to ensure reliable and effective thermal management. Its fin arrangement design allows for a high degree of heat dissipation, while its fan-assisted operation ensures a steady supply of cooled air is delivered to the components. Furthermore, its robust construction ensures the heat sink is capable of sustaining temperatures up to 1,000 Watts, and is designed to excel in a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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