SIP1X04-011BLF Allicdata Electronics
Allicdata Part #:

SIP1X04-011BLF-ND

Manufacturer Part#:

SIP1X04-011BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 4POS GOLD
More Detail: N/A
DataSheet: SIP1X04-011BLF datasheetSIP1X04-011BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: --
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: SIP1x
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 4 (1 x 4)
Type: SIP
Part Status: Obsolete
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors

Sockets, also known as integrated circuit (IC) holders, are common devices for connecting, storing and transporting integrated circuits or transistors. Socket technology is used extensively in high-frequency communications systems and circuit boards, and is becoming increasingly popular for its ability to achieve lower levels of electromagnetic interference (EMI) while protecting the integrity of today\'s sophisticated IC chips. One of the most popular sockets is the SIP1X04-011BLF, an advanced socket designed for high-speed applications.

The SIP1X04-011BLF socket has some superior features that make it ideal for many applications. Its small size and low profile provide robust protection in a confined space. It also features an integrated heat sink that dramatically reduces thermal signature, allowing for a more efficient application where large heat sinks are not feasible. The Biaxial Insertion Force Sensor (BIFS) built into the socket helps maintain secure connection between the IC chip and the printed circuit board (PCB). The BIFS also allows for re-enactment of the insertion process which enhances long-term reliable connections.

The primary application field for the SIP1X04-011BLF is high-frequency boards, such as those in SDRs (Software Defined Radios) and other communications and signal processing devices. Its low-profile design and superior thermal management make it ideal for boards where space is limited and where components need to be cooled rapidly. The built-in BIFS and other features make the device ideal for high-reliability, high-density applications.

The working principle of the SIP1X04-011BLF is simple but effective. An interposer board is inserted between the IC chip and the system’s printed circuit board (PCB). The interposer board contains contact pins which attach to the system\'s PCB and translate the soldered IC onto the interposer. The interposer then connects to the socket, which in turn connects to the system\'s PCB. This allows for the socket to be replaced easily without the need to solder the IC chip to the PCB, thus providing a more reliable connection.

The SIP1X04-011BLF is a unique socket designed to maximize thermal management, reduce EMI, and provide secure connections. Its primary application is high-frequency devices such as SDRs, and its superior design makes it ideal for high-reliability, high-density applications. Its working principle is simple but effective, providing a reliable and durable connection without the need for soldering the IC chip directly onto the system\'s PCB.

The specific data is subject to PDF, and the above content is for reference

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