TXBF-019-025B Allicdata Electronics
Allicdata Part #:

294-1004-ND

Manufacturer Part#:

TXBF-019-025B

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: THERMAL LINK PRESSON TO-18
More Detail: Heat Sink TO-18 Beryllium Copper Top Mount
DataSheet: TXBF-019-025B datasheetTXBF-019-025B Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: Fan Top
Part Status: Obsolete
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Shape: Cylindrical
Length: --
Width: --
Diameter: 0.500" (12.70mm) OD
Height Off Base (Height of Fin): 0.250" (6.35mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 150.00°C/W
Material: Beryllium Copper
Material Finish: Black Cadmium
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat Sinks are some of the most essential components in central and distributed cooling systems. They are used to disperse and remove heat from the enclosed environment in which electronics are operated. Heat Sinks have the potential to greatly improve the performance and safety of a wide range of electronic devices such as computers, routers, electrical power stations and any other electronic device that could be exposed to excessive levels of heat. The TXBF-019-0259 Heat Sink is specifically designed to provide high performance air cooling with its highly efficient aluminium and copper construction.

The TXBF-019-0259 Heat Sink is composed of an extruded aluminium fins and drawn copper heat pipes. These components work together to transfer heat away from the processor and other components within the computer enclosure. The extruded aluminium fins provide a vast surface area to dissipate the heat, whilst the copper heat pipes provide excellent thermal conductivity to quickly move the heated air away. The design also allows for uniform airflow with high air pressure at off-center locations. The combination of aluminium fins and copper heat pipes results in a highly efficient heat-dissipation solution for applications that require effective cooling.

The TXBF-019-0259 Heat Sink is suited to various applications including telecommunication, industrial, server and general cooling. The combination of temperature range, airflow, output and design flexibility makes the TXBF-019-0259 an ideal solution for a variety of cooling needs. Additionally, the size of the heat sink is kept relatively small, providing a more efficient cooling solution compared to larger heat sinks.

The TXBF-019-0259 Heat Sink has a working temperature range of -20 to +90 degrees Celsius, meaning that it can handle high temperatures without compromising performance. The dual-axis design of the Heat Sink allows for high air pressure at multiple locations, ensuring that hot and airflow exchange efficiently. The sophisticated design allows for easy installation and use of air-flow adjustment for each specific environment.

The TXBF-019-0259 Heat Sink is renowned for its high performance cooling ability, as well as its energy efficiency. The combination of copper heat pipes and extruded aluminium fins provide excellent heat transfer capabilities, whilst operating at a low-power rating. This makes the TXBF-019-0259 an ideal choice for energy efficient systems and applications where high performance cooling is required.

The TXBF-019-0259 Heat Sink is the perfect choice for applications that require temperature control and high performance cooling. Its design provides high air pressure and a wide temperature range to ensure effective heating and cooling. Its small size also makes it ideal for energy efficient systems, allowing for an efficient and effective cooling solution.

The specific data is subject to PDF, and the above content is for reference

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