TXBF032025B Allicdata Electronics
Allicdata Part #:

294-1122-ND

Manufacturer Part#:

TXBF032025B

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: THERMAL LINK PRESSON TO-5
More Detail: Heat Sink TO-5 Beryllium Copper Top Mount
DataSheet: TXBF032025B datasheetTXBF032025B Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: Fan Top
Part Status: Obsolete
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Shape: Cylindrical
Length: --
Width: --
Diameter: 0.750" (19.05mm) OD
Height Off Base (Height of Fin): 0.250" (6.35mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 81.10°C/W
Material: Beryllium Copper
Material Finish: Black Cadmium
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

TXBF032025B is a thermal – heat sink designed for use in the aerospace industry. As a lightweight heat dissipater, TXBF032025B is able to absorb large amounts of heat generated by applications such as process controllers or high powered avionics systems. TXBF032025B is designed with a low power consumption, which allows it to be used in smaller spaces than traditional heat sinks.

The TXBF032025B design has been optimized to maximize the performance of the heat sink. It has a high thermal dissipation capability and high thermal conductivity. The overall thermal transfer rate is higher than traditional heat sink designs, allowing it to provide better cooling than standard heat sinks. Additionally, the TXBF032025B uses a combination of both conduction and convection to provide effective cooling to any application.

The working principle of the TXBF032025B is based on the concept of thermodynamics. This process helps to transfer the heat generated by an application or system into a more manageable form, typically a liquid or gas. In the case of the TXBF032025B, the heat generated is transferred via conduction and convection into the sink itself. The sink\'s fins then transfer the heat away from the application or system, helping to keep it from overheating.

The TXBF032025B has been tested and proven in laboratory and field tests. The design is designed to provide effective cooling performance in even the most extreme aerospace and other industrial or environmental conditions. The heat sink is versatile enough to be used for a wide variety of applications, including automotive, electronics, and aircraft. Its design is also ideal for use in avionics and other high-end systems that require precise cooling.

In summary, TXBF032025B is a lightweight thermal – heat sink designed for use in aerospace applications. Its low power consumption and efficient cooling capabilities make it an ideal choice for applications that require precise cooling. The TXBF032025B uses a combination of both conduction and convection to transfer the generated heat away from the application or system, helping to keep it from overheating. The TXBF032025B has been tested and proven, ensuring that it provides reliable cooling performance in any environment.

The specific data is subject to PDF, and the above content is for reference

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