Allicdata Part #: | 294-1140-ND |
Manufacturer Part#: |
TXBF-019-025U |
Price: | $ 0.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | THERMAL LINK PRESSON TO-18 |
More Detail: | Heat Sink TO-18 Beryllium Copper Top Mount |
DataSheet: | TXBF-019-025U Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | Fan Top |
Part Status: | Obsolete |
Type: | Top Mount |
Package Cooled: | TO-18 |
Attachment Method: | Press Fit |
Shape: | Cylindrical |
Length: | -- |
Width: | -- |
Diameter: | 0.500" (12.70mm) OD |
Height Off Base (Height of Fin): | 0.250" (6.35mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 150.00°C/W |
Material: | Beryllium Copper |
Material Finish: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important consideration for many applications, from simple devices like computer CPUs to complex satellites and aerospace components. Heat sinks are critical components in many of these applications to help disperse and regulate the amount of heat produced by a given device. The TXBF-019-025U is a high efficiency, thick fin heat sink that is designed for a range of applications with a wide variety of requirements.
The TXBF-019-025U is a robust and reliable heat sink. Its aluminum construction ensures strong, efficient thermal performance while its 15 mm thick fins provide exceptional heat dissipation capabilities. The one-piece design allows for quick and easy installation, making it ideal for most applications. The device is designed to accept both commercial and military grade fins, making it suitable for a variety of applications. Additionally, the device is available in multiple lengths and comes with highly customizable mounting brackets, allowing for greater flexibility in mounting solutions.
The TXBF-019-025U has an underlying working principle that makes it useful in a variety of applications. Heat sinks work by dissipating heat away from a device into the surrounding environment. Heat is conducted from the hot device through the heat sink fins. The fins absorb and disperse the heat, spreading it out over a larger area and making it easier to dissipate. This enables the device to cool down and prolong its life.
The TXBF-019-025U is rated to withstand temperatures up to 300°C and with minimal fan speed the fin area enhanced heat dissipation up to 8 percentage points greater than air cooling alone. The TXBF-019-025U is able to maintain its temperature even under high workloads, which makes it suitable for applications such as high power LEDs, AC/DC supplies, motor controls, and many more industrial equipment.
The TXBF-019-025U is a great choice for a variety of thermal management applications. Its thick fin construction and effective thermal conduction ensures efficient cooling at a very reasonable cost. The device is also designed for easy installation and customization, making it a great choice for both small-scale and large-scale applications. With its low profile and flexible mounting solutions, the TXBF-019-025U is an ideal choice for a wide variety of heat sink applications.
The specific data is subject to PDF, and the above content is for reference
Part Number | Manufacturer | Price | Quantity | Description |
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