TXBF2-050-033B

Series:	Fan Top
Part Status:	Obsolete
Type:	Top Mount
Package Cooled:	TO-8
Attachment Method:	Press Fit
Shape:	Cylindrical
Length:	--
Width:	--
Diameter:	1.250" (31.75mm) OD
Height Off Base (Height of Fin):	0.330" (8.38mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	41.00°C/W
Material:	Brass
Material Finish:	Black Cadmium

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Thermal – Heat Sinks

Heatsinks are a type of cooling solution often used to transfer heat away from an electronic component, device, or system. They are particularly important tools in computer engineering, especially as chip speeds and complexity increases. In many cases, heat must be controlled to keep electronic components from overheating and causing damage or system failure.Heat sinks provide the most effective way of dissipating heat from an electronic device or component. They accomplish this by using one or several fins attached to a substrate material, such as aluminum, copper, or stainless steel. Heat is then carried away from the component to the air, allowing it to cool. An array of fins is typically used to maximize surface area for the transfer of heat, thus optimizing heat dissipation.One type of heat sink widely used in both industrial and commercial applications is the TXBF2-050-033B. TXBF2-050-033B heat sinks are made of aluminum, which is known to be a highly efficient thermal conductor and heat disperser. It is also incredibly lightweight, making it an ideal choice for many electronic applications. It offers high performance in thin and compact designs, making it ideal for many small-scale and high-density electronic components that are unable to withstand higher temperatures.The TXBF2-050-033B also offers significant customization options. Its unique design and shape allows the creation of various customized heat sink profiles that can better meet the individual needs of any application. Its thickness and size can be modified to fit the dimensions of a particular application, allowing for a greater variety of solutions.The TXBF2-050-033B also has a unique working principle. It works by spreading the heat from the component being cooled to the fins of the heat sink. It then transfers heat away from these fins into the air, allowing it to cool. The fins of the heat sink are designed in an array, so more and more heat is dispersed from the component as it passes through the fins, ensuring high performance and efficient cooling.The TXBF2-050-033B is an excellent choice for applications that require a reliable and efficient cooling solution. Not only is it extremely light and cost-effective, it is also highly customizable and has a unique working principle that provides excellent cooling performance. It is a versatile tool that is suitable for a variety of uses and can be used to provide a reliable and efficient cooling solution for any electronic application.

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Part Number	Manufacturer	Price	Quantity	Description