Allicdata Part #: | AE11388-ND |
Manufacturer Part#: |
V2016B |
Price: | $ 0.34 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK CPU XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | V2016B Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 0.30870 |
10 +: | $ 0.29106 |
25 +: | $ 0.27644 |
50 +: | $ 0.26926 |
100 +: | $ 0.26561 |
250 +: | $ 0.24741 |
500 +: | $ 0.23285 |
1000 +: | $ 0.21102 |
5000 +: | $ 0.20374 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Square, Pin Fins |
Length: | 0.335" (8.50mm) |
Width: | 0.335" (8.50mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.315" (8.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 32.00°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
V2016B is a thermal-heat sink developed by the technology company called Vossloh-Schwabe. It is specifically designed for various devices that require high thermal performance, such as industrial equipment, laser diode, and LED applications. Additionally, it is also suitable for applications where a high degree of thermal stability is desired.
The V2016B is composed of a plate and fin heat sink made with aluminum alloy material. This heat sink provides its own support system with its internal attachment points and the air flow is optimized through the heat dissipation by the fins, allowing for more efficient cooling. This efficiency comes from its unique fin design that increases the overall thermal conductivity while reducing the thermal resistance, making the heat sink one of the most efficient on the market.
The V2016B can accommodate numerous types of thermal devices. Along with its compatibility with a variety of thermal devices, the device’s performance is unparalleled. Its highly efficient fins provide an increased surface area which enhances its capability to dissipate heat. This allows for a rapid decrease in the temperature of the impacted device when submerged in a cooled environment and a maximum retention of heat when the device is required to operate at higher levels.
The working principle of the V2016B in a nutshell is its capacity to absorb heat from the device while it dissipates it quickly into the surrounding environment. This is worked to its optimal efficiency because of the heat sink’s fin design, maximizing the overall surface area by introducing more holes (weaker points) and not obstructing its air flow. As a result, the heat is emitted quickly, reducing the thermal resistance and allowing the device to reach its optimal temperature quickly.
The V2016B is used primarily in the application field of consumer electronics, particularly those that require higher levels of thermal performance. For example, it is used in video cards, computer motherboards, and industrial systems. Furthermore, it is effective in managing the heat generated by lasers and LED lights used in stage lights and laser projectors. In addition, it is suitable for medical device such as patient monitoring systems, ultrasound machines, and diagnostic equipment.
In conclusion, the V2016B is a heat sink developed for use in multiple applications that require an increase in thermal performance. This heat sink is composed of aluminum alloy material that provides its own support system while the fin design allows for increased heat dissipation and maximum retention of heat. Its working principle states that the device absorbs and dissipates heat quickly without any obstruction to its air flow. It is primarily used in the application field of consumer electronics as well as medical devices such as ultrasound machines and diagnostic equipment.
The specific data is subject to PDF, and the above content is for reference
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