Allicdata Part #: | AE10837-ND |
Manufacturer Part#: |
V2017B |
Price: | $ 0.40 |
Product Category: | Fans, Thermal Management |
Manufacturer: | ASSMANN WSW Components |
Short Description: | HEATSINK ANOD ALUM CPU |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | V2017B Datasheet/PDF |
Quantity: | 17363 |
1 +: | $ 0.35910 |
10 +: | $ 0.34020 |
25 +: | $ 0.32332 |
50 +: | $ 0.31475 |
100 +: | $ 0.31046 |
250 +: | $ 0.28917 |
500 +: | $ 0.27216 |
1000 +: | $ 0.24665 |
5000 +: | $ 0.23814 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | -- |
Shape: | Square, Pin Fins |
Length: | 0.394" (10.00mm) |
Width: | 0.394" (10.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.275" (7.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 31.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The V2017B thermal-heat sink is a thermal-heat management device used to regulate the temperature of small and medium-sized electronic components. It is an anodized aluminum heat sink with four integral fins and its own thermal insulation layer to protect the components from thermal discrepancies. It is an open-loop system that works on the principle of convection, involving the circulation of air in order to dissipate the generated heat. This heat sink has a maximum heat capacity of 35W and a thermal resistance of 0.2°C/W at a maximum operating temperature of 110°C.
The four integral fins on the heat sink are designed to maximize air circulation and heat dissipation. The thermal insulation layer helps to keep the components from overheating when the temperature inside the system rises while performing a task. The insulation layer also prevents the outside ambient temperature from affecting the working temperature of the components inside the system.
The V2017B performs its job in two main steps. First, the generated heat is absorbed and then dissipated by the fins and the insulation layer. The absorbed heat energy is then transferred to the air which circulates in the fins and is eventually dissipated outdoors. The radiator fins are designed to be as thin as possible to reduce the amount of air needed for heat transfer, thus improving system efficiency.
The V2017B also has an efficient safety mechanism in place. Its three-layer protection system helps to prevent overheating of the components, thus avoiding any potential damage. The upper layer of the heat sink acts as a protection layer which helps to dissipate the generated heat, while the middle layer acts as a thermal interface which helps to minimize heat transfer and keep the temperature of the components under control. The lower layer, which is the main cooling layer, acts as an additional layer of protection against any excess heat that is generated.
Overall, the V2017B thermal-heat sink is an effective device for controlling the temperature of small and medium-sized electronic components. It is easy to install and maintain and its efficient safety system makes it an ideal choice for providing efficient and reliable thermal-heat management. The V2017B is a great choice for controlling the temperature of most electronic devices and is a must-have for keeping your components and equipment safe and in optimal condition.
The specific data is subject to PDF, and the above content is for reference
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