W632GG8KB12I Allicdata Electronics
Allicdata Part #:

W632GG8KB12I-ND

Manufacturer Part#:

W632GG8KB12I

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Winbond Electronics
Short Description: IC DRAM 2G PARALLEL 78WBGA
More Detail: SDRAM - DDR3 Memory IC 2Gb (256M x 8) Parallel 800...
DataSheet: W632GG8KB12I datasheetW632GG8KB12I Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tray 
Part Status: Discontinued at Digi-Key
Memory Type: Volatile
Memory Format: DRAM
Technology: SDRAM - DDR3
Memory Size: 2Gb (256M x 8)
Clock Frequency: 800MHz
Write Cycle Time - Word, Page: --
Access Time: 20ns
Memory Interface: Parallel
Voltage - Supply: 1.425 V ~ 1.575 V
Operating Temperature: -40°C ~ 95°C (TC)
Mounting Type: Surface Mount
Package / Case: 78-TFBGA
Supplier Device Package: 78-WBGA (10.5x8)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction: W632GG8KB12I is an advanced memory chip, developed by Intel and manufactured by Micron, that combines high-performance storage and low power consumption. It achieved high speeds in both read and write operation while consuming minimal energy. Its architecture is composed of four layers of interconnected cells with different functionality. This unique design enables fast operation, while optimizing power efficiency.

Application Field: W632GG8KB12I is a great choice for those seeking high performance without sacrificing energy efficiency in mobile devices and other applications with strict power requirements. Specifically, it is ideal for applications such as gaming consoles and laptops that need precision control over speed and latency. Additionally, its memory controller supports sophisticated optimization and heat management, making it an ideal choice for battery-powered applications. Further, its tight integration with Intel processors leads to improved memory performance in devices with minimal power draw.

Working Principle: The W632GG8KB12I works by utilizing a triple-layer memory architecture to maximize throughput and minimize power consumption. The architecture works by having the first layer of memory cells connected to the processor, with the second layer of memory cells connected to the second layer of memory cells. This effectively creates a faster path between the processor and the memory, allowing information to pass between the two components more quickly. The third layer of memory cells is also connected to the processor, allowing for optimization of both read and write performance. Additionally, the memory controller is embedded within the architecture, allowing for further optimization and efficient power management.

Conclusion: W632GG8KB12I is an advanced memory chip designed specifically for mobile devices and other applications with strict power requirements. Its triple-layer memory architecture helps to optimize speed and power efficiency, while its embedded memory controller facilitates powerful optimization and heat management features. Overall, the W632GG8KB12I offers the highest levels of performance and energy efficiency, making it the ideal choice for battery-powered applications.

The specific data is subject to PDF, and the above content is for reference

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