Allicdata Part #: | 122-1329-ND |
Manufacturer Part#: |
XC2S50E-6FTG256I |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Xilinx Inc. |
Short Description: | IC FPGA 182 I/O 256FTBGA |
More Detail: | N/A |
DataSheet: | XC2S50E-6FTG256I Datasheet/PDF |
Quantity: | 1000 |
Series: | Spartan®-IIE |
Part Status: | Obsolete |
Number of LABs/CLBs: | 384 |
Number of Logic Elements/Cells: | 1728 |
Total RAM Bits: | 32768 |
Number of I/O: | 182 |
Number of Gates: | 50000 |
Voltage - Supply: | 1.71 V ~ 1.89 V |
Mounting Type: | Surface Mount |
Operating Temperature: | -40°C ~ 100°C (TJ) |
Package / Case: | 256-LBGA |
Supplier Device Package: | 256-FTBGA (17x17) |
Base Part Number: | XC2S50E |
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XC2S50E-6FTG256I is a Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family of products. An FPGA is a semiconductor device that is programmable by a user to create custom logic designs. FPGAs are typically used in embedded system applications requiring the ability to design and implement functionality not readily available in off-the-shelf parts. Of particular interest in this case is the XC2S50E-6FTG256I due to its low-cost and small size.
The XC2S50E-6FTG256I is a 6.5 x 6.5 mm Wide-Temperature FPGA, with 2000 gates and 512 flip-flops. It is manufactured in a 250 nm low-cost 0.18 µm CMOS process, and is capable of operating over a -40°C to +85°C temperature range. Employing a three-level architecture, each of the four logic cell clusters of this device contain 1 flip-flop and 16 logic gates. The four logic cell clusters are connected by two-level programmable interconnect. XC2S50E-6FTG256I also features Routing SelectRAM/ROM and non-multiplexed I/ O blocks, that provide the flexibility needed for designs requiring low cost and simplified debugging.
The XC2S50E-6FTG256I is typically used in embedded applications such as car-navigation systems, medical systems, and consumer electronic products. Its small size and low-cost make it an attractive choice for applications where space and cost are a concern. Due to its wide range of operating temperatures, it can also be used in applications where extreme temperature conditions are encountered.
The XC2S50E-6FTG256I works on a simple principle. A Boolean logic circuit inside the chip is designed to recognize a certain set of input values and correspondingly produce specific output values. This design can be optimized by changing the Boolean logic circuit according to the requirement. Designers using the XC2S50E-6FTG256I can therefore create customized logic circuits of the desired size, without having to worry about the actual hardware implementation of the circuit.
In summary, the XC2S50E-6FTG256I is an embedded Field Programmable Gate Array with a wide range of operating temperatures, small size and low-cost that makes it an attractive choice for embedded applications. It works on the principle of a Boolean logic circuit which allows for designing circuits of a custom size to suit the tasks at hand.
The specific data is subject to PDF, and the above content is for reference
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XC2S30-5CSG144C | Xilinx Inc. | -- | 1000 | IC FPGA 92 I/O 144CSBGA |
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