XCZU3EG-1SBVA484I Allicdata Electronics
Allicdata Part #:

XCZU3EG-1SBVA484I-ND

Manufacturer Part#:

XCZU3EG-1SBVA484I

Price: $ 349.55
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC FPGA 82 I/O 484FCBGA
More Detail: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dua...
DataSheet: XCZU3EG-1SBVA484I datasheetXCZU3EG-1SBVA484I Datasheet/PDF
Quantity: 1000
1 +: $ 317.77200
Stock 1000Can Ship Immediately
$ 349.55
Specifications
Series: Zynq® UltraScale+™ MPSoC EG
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size: --
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 600MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (19x19)
Number of I/O: 82
Description

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Introduction to XCZU3EG-1SBVA484I Embedded - System On Chip (SoC)

XCZU3EG-1SBVA484I is an integrated System On Chip (SoC) developed by Xilinx, Inc. It is a member of their Xilinx UltraScale+ series of FPGA products and is based on the Xilinx UltraScale+ architecture. It integrates a host of features and a complete library of IP cores while enabling high-density connectivity to an SoC programmable logic system. This advanced FPGA features transceivers reduced insertion in terms of both power and cooling costs when utilizing high bandwidth applications. It provides a high-performance-computing platform for high-bandwidth applications such as IPSec & Encryption, Networking & Security, Core Switch & Router, and wireless solutions. Its devices consist of up to 7 mix-signal variable speed transceivers, which enable it to support a wide range of data rates. These transceivers provide users with a cost-effective way to implement a high-performance transceiver system.

Applications of XCZU3EG-1SBVA484I

XCZU3EG-1SBVA484I is used in both mobile and embedded applications, and is found in many different applications and markets. Its high-speed capabilities make it ideal for applications such as video broadcasting, wireless communication, and medical imaging. It is especially ideal for designs that require transmitting and receiving large amounts of data at high speed. XCZU3EG-1SBVA484I is also used in automotive applications, IoT and Artificial Intelligence (AI) solutions. It is capable of providing ultra-low power performance needed for both battery-powered and automotive portfolio applications. XCZU3EG-1SBVA484I provides advanced security solutions, allowing users to protect their data from malicious attacks with its on-device root of trust. In sum, XCZU3EG-1SBVA484I can be used in many different applications due to its high-speed and high-density connectivity.

Working Principle of XCZU3EG-1SBVA484I

XCZU3EG-1SBVA484I uses a combination of advanced silicon technologies to deliver the required performance, power, and area targets. Xilinx’s proprietary UltraScale+ architecture enables these devices to feature 7 mix-signal variable speed transceivers. In addition, these devices offer up to 32.5K logic cells, 12.4Mb block RAM, and are ready to execute some of Xilinx’s provided IP cores. XCZU3EG-1SBVA484I combines many different components and aspects of embedded system design into one, which allows customers to have better control over the design space and reduce their project risks and development costs. In particular, Xilinx has developed a VX9500 Vivado Design Suite and Vivado Embedded Development Kit (EDK), which allow developers to go from concept to a working system in a faster and more efficient way. In addition, the Vivado EDK provides designers with the ability to quickly and easily program their projects.

XCZU3EG-1SBVA484I provides a combination of high-performance, high-density, and low-power design capabilities. It helps to reduce the total cost of ownership while offering the highest levels of scalability and flexibility. XCZU3EG-1SBVA484I offers a broader range of features including advanced power-down options, Xram technology for large on-chip FIFO memory, new on-chip debug technology, and flexible design opportunities for programming and debugging. Xilinx has included additional IP cores with the XCZU3EG-1SBVA484I such as Gigabit Ethernet, USB, and SPI that can run in the range of 11-200MHz, allowing for flexibility in system design.

Conclusion

XCZU3EG-1SBVA484I is an integrated System On Chip (SoC) that is classified as Embedded – System On Chip (SoC). It is designed to handle high bandwidth applications as well as supporting high-reconfigurability and high-performance-computing platforms. XCZU3EG-1SBVA484I supports up to 7 mix-signal variable speed transceivers, has high-density connectivity, and is capable of providing ultra-low power performance. It provides a range of features including advanced power-down options, Xram technology, on-chip debug technology and flexible design opportunities. Applications of the XCZU3EG-1SBVA484I are found in mobile, embedded, medical imaging, automotive, IoT, and AI solutions. Xilinx also offers a VX9500 Vivado Design Suite and Vivado Embedded Development Kit (EDK) to assist developers. Xilinx has included additional IP cores with the XCZU3EG-1SBVA484I to enable flexibility in design and reduce total cost of ownership.

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