XCZU15EG-1FFVC900I

Series:	Zynq® UltraScale+™ MPSoC EG
Packaging:	Tray
Part Status:	Active
Architecture:	MCU, FPGA
Core Processor:	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:	--
RAM Size:	256KB
Peripherals:	DMA, WDT
Connectivity:	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:	500MHz, 600MHz, 1.2GHz
Primary Attributes:	Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature:	-40°C ~ 100°C (TJ)
Package / Case:	900-BBGA, FCBGA
Supplier Device Package:	900-FCBGA (31x31)
Number of I/O:	204

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Xilinx Zynq UltraScale+ MPSoCs are a family of multicore SoC devices built on the 16nm FinFET process. The XCZU15EG-1FFVC900I is part of the family that is designed to combine an advanced flexible heterogeneous quad-core ARM Cortex-A53/ Dual-Core ARM Cortex-R5 processing system with Zynq UltraScale+ MPSoC\'s programmable logic. This combination provides a single platform for embedded developers to build high-performance, low power, and cost-effective System on Chip (SoC) solutions.The Zynq UltraScale+ MPSoCs devices utilize advanced 28nm silicon interconnect technology to enable extremely high device integration and substantial system performance and scalability. This includes features like high-bandwidth, low-latency network on chip for communication between the processor and the programmable logic, and several other system peripherals such as Ethernet, USB, UART, CAN, and I2C buses. This allows developers to design more efficient, reliable, and high-performance embedded systems.The XCZU15EG-1FFVC900I is especially designed for automotive applications with its highprocessing performance and low-power consumption. It is capable of withstanding extreme environmental conditions with its high temperature range (-40°C to +105°C) and reduced thermal resistance performance. The XCZU15EG-1FFVC900I supports various interfaces such as PCIe, DDR4, USB 3.0, and PCIe Gen3 End.This device also utilizes Xilinx\'s Vivado Design Suite\'s easy-to-use design environment and rich set of IPs to quickly configure, debug, and integrate various hardware components into a cohesive system. Vivado also supports development of custom FPGA IPs and Xilinx\'s UltraScale+ MPSoCs includes a rich set of libraries for embedded software development. This provides developers the flexibility to integrate different hardware components and custom IPs into the system according to their individual needs. The XCZU15EG-1FFVC900I can be processed by a Linux operating system which provides developers transparent access to system resources and ensures a vast array of applications and devices can work together seamlessly. This makes the device highly suitable for a wide range of applications in industries such as data centers, aerospace and defense, automotive, healthcare, and industrial automation. The XCZU15EG-1FFVC900I device comes with Xilinx\'s advanced design technology, the Zynq UltraScale+ RFSoC architecture, to maximize the performance, flexibility, and efficiency of embedded designs. This design environment supports transceivers with up to 25 Gbps of bandwidth and provides flexibility in the number of channels, data rate, and frequency operation that can be deployed. This ability is ideal for high-speed communications, software-defined radios, and wideband LTE radio systems. Moreover, this device supports Xilinx\'s Vivado Design Suite\'s High Level Synthesis (HLS) which reduces development time.In conclusion, the XCZU15EG-1FFVC900I device is a multifunctional System on Chip (SoC) that enables embedded developers to quickly create high-performance, low-power, and cost-effective systems for a variety of application areas. With its powerful features such as increased transceiver bandwidth, flexible features, and Xilinx\'s advanced design technology, this device provides developers the ability to develop complex designs that can meet their individual requirements.

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